The NiCrAlY＋(ZrO₂＋Y₂O₃) thermal barrier coating was prepared on the surface of refractory steel (1Cr18Ni9Ti) by plasma spraying technique. SEM observation showed that the bonding between thermal barrier coating and substrate was good. The surface hardness of 1Cr18Ni9Ti was improved, the microhardness of coating surface was about 673HV after the thermal barrier test at 850℃. The test results showed that the thermal barrier properties were improved remarkably. The phases and microstructure of the thermal barrier coating were determined by SEM.

Recent developments over these years on the surface treatment for aluminum and its alloys by micro-arc oxidation (MAO) were reviewed. The effects of the substrates and the electric parameters such as current density, voltage and frequency on the growth, composition, structure and properties of the MAO coatings on aluminum alloys were emphasized. The common electrolyte systems used in the MAO treatment for aluminum alloys were analyzed. The characteristics of kinetics and the growth mechanism of the MAO coatings on aluminum alloys were described. It was pointed out that the control of electric parameters and adjustment of composition and concentration of electrolyte would be the study emphases of MAO technique for aluminum alloys in the future.

Macroscopic solid superlubricity (with a friction factor on the order of 0.001) in diamond-like carbon (DLC) films has attracted widespread attention in the academic community in recent years due to its significant potential in the domain of solid lubrication under extreme working conditions, such as vacuum, high contact pressures, and wide temperature ranges. However, the deposition methods and bonding structures of DLC films are diverse, and specific intrinsic compositions and structures, as well as external working conditions, are required to achieve macroscopic superlubricity in DLC films. Thus, this review discusses current research progress on the structural regulation of DLC films, diverse superlubricity behaviors in DLC films, key influencing factors, and their corresponding mechanisms. First, the current structural classification, deposition methods, and recent research on the bonding structure regulation principles of DLC films for solid superlubricity were summarized. An effective strategy for synthesizing DLC films with superior solid superlubricity is to adjust the composition and energy of deposition ions to balance the surface chemisorption and subsurface implantation growth modes, leading to an optimized combination of mechanical stiffness and hydrogen content of DLC films. Subsequently, the research trajectory on superlubricity in DLC films was reviewed, and the latest developments categorized by mechanisms were introduced. The combinations of DLC and environmental media available for superlubricity are diverse, and include hydrogenated amorphous carbon (a-C:H) in dry inert atmospheres, doped a-C:H in humid air or water-based liquids, hydrogen-free DLC in oil-based liquids, and DLC films in nanomaterial-containing environments. Furthermore, the influencing mechanisms of the internal elemental composition and bonding structure of DLC films, as well as external working conditions such as the environment, contact pressure, and temperature on the superlubricity behavior of DLC are discussed in detail. Sufficient hydrogen content is necessary for DLC films to achieve superlubricity in dry inert atmospheres, such as N₂, Ar, and vacuum. The self-lubrication properties of DLC films can be significantly affected by O₂ and H₂O molecules in humid air, due to intensified interfacial chemical bonding, disordered water adsorption layers, enhanced hydrogen bonding forces, and van der Waals forces caused by tribo-chemically generated highly polar groups. Elemental doping with Si, S, and Ti can effectively suppress the moisture sensitivity of DLC films via their participation in the structural evolution of sliding interfaces. Sufficiently high contact pressure is also necessary for solid superlubricity in DLC films, which is mainly due to the self-lubrication effect of contact-pressure-triggered locally short-range-ordered layered-like sp² nanoclustering structures. Overly high contact pressure deteriorates the superlubricity state of DLC films through hydrogen detachment and microstructural destruction of the counterpart surfaces. Ultralow temperature (<-100 ℃) can increase the friction factor of DLC films due to the suppression of thermal activation and structural evolution of sliding interfaces. On the contrary, high temperature (>300 ℃) facilitates the failure of a-C:H films due to excessively promoted hydrogen detachment, graphitization, and oxidation in air. Additionally, the mechanism behind the solid superlubricity of DLC is discussed from the perspective of interfacial bonding structural evolution. The tribo-generated transfer films on smooth-stiff surfaces, hydrogen passivation of surface dangling bonds, and generation of short-range ordered graphite-like nanostructures are key factors for the establishment of superlubricity in DLC films, which simultaneously suppress the three main contributors of macroscopic friction force: interfacial abrasion, shearing, and adhesion effect. Finally, the unresolved issues and related research trends in the underlying science and engineering applications of DLC are summarized. The connection of deposition parameters with growth theories, the nanostructure of superlubricious sliding surfaces and their evolutionary pathway, the environment and working condition sensitivity, and the influencing mechanisms of multi-element, multilayer, micro-nano textured, and media-synergistic lubrication strategies require further research. These findings can provide technical support for the design and application of superlubricious DLC films for dry-sliding friction pairs under extreme engineering conditions.

Plasma Immersion Ion Implantation and Deposition technology (PIIID) can obtain a uniform and perpendicular ion implantation on the components with sophisticated shape. It has shown great potential in surface modification for industrial components. After its invention, PIIID has developed rapidly in recent years. However, in order to get wide commercial applications, the methods for high efficiency ion implantation, inner surface ion implantation and large area ion implantation should be proposed.

Single-crystal diamond (SCD), owing to its exceptional physical properties—including an ultrawide bandgap of 5.5 eV, an extremely high breakdown electric field of 9.9 MV / cm, and an outstanding thermal conductivity of 22 W / (cm·K)—is widely recognized as a revolutionary material capable of overcoming the performance limitations of silicon-based integrated circuits (ICs). However, the extraordinary hardness (Mohs hardness of 10) and extreme chemical inertness of diamonds present significant challenges for achieving atomic-level surface polishing, which is crucial for their application in high-end chip manufacturing. This study focuses on the development of atomic-level polishing techniques for SCD, systematically reviews the evolution of polishing technologies from micro / nanoscale to atomic precision, and identifies key breakthroughs to overcome existing machining limitations. Additionally, this study examines the characteristics and applicability of various polishing methods, thus providing valuable insights for practical implementation. First a mechanical polishing techniques, including conventional and ultrasonic-assisted methods, are investigated comprehensively. Whereas these approaches offer straightforward processes, the inherent “hard-on-hard” friction inevitably introduces surface defects, thus rendering it difficult to achieve subnanometer surface smoothness. Subsequently, high-energy beam polishing technologies, such as lasers, ion beams, and plasma polishing, are examined. Although these methods replace abrasive particles with high-energy particles, issues such as inferior selectivity, deep thermally affected zones, and particle implantation limit their ability to achieve low subsurface damage and subnanometer planarization. The third category, i.e., multifield coupled polishing, which includes chemical-mechanical polishing and plasma-assisted polishing, leverages synergistic effects for surface planarization. However, these methods are characterized by complex processes and low polishing rates. Based on a detailed comparative analysis, this study highlights the significant challenges in satisfying the stringent requirements of IC manufacturing: subnanometer precision, minimal damage, and high processing rates. The findings suggest that, although existing polishing techniques are adopted in specific applications, they remain inadequate for completely satisfying the abovementioned demanding criteria. Achieving atomic-level surface polishing requires not only gradual process improvements but also systematic innovations in theoretical understanding and process development. This study emphasizes the necessity of cross-scale control from macroscopic process parameters to microscopic atomic behavior to precisely regulate material removal mechanisms, including the synergy between mechanical shear and chemical etching, as well as the energy threshold for atomic bond breaking. At the fundamental research level, the development of atomic-resolution in-situ characterization techniques and first-principles computational models is crucial for establishing quantitative relationships between process parameters and atomic surface configurations. The results indicate that atomic-scale manufacturing must rely on multifield synergistic regulation combined with in-situ atomic-level monitoring and intelligent control to achieve precise process optimization and further advance ultraprecision manufacturing. Despite significant progress, several technical bottlenecks remain in achieving atomic-level polishing for SCD. First, multifield coupling mechanisms are yet to be fully understood, thus resulting in trade-offs between the material-removal rate and surface quality in mechanical polishing, as well as issues such as high equipment costs and instability in energy-beam polishing. Additionally, multifield coupling techniques present challenges such as dynamic parameter mismatches (e.g., pH fluctuations and uneven light distributions), thus hindering stable and efficient processing. Second, intelligent control systems for polishing processes remain underdeveloped, with limited real-time optimization capabilities and insufficient integration of smart algorithms with in-situ characterization techniques. This results in a trial-and-error approach for process optimization. Third, the industrialization of green and efficient processes is hampered by key obstacles such as high energy consumption, environmental risks, and low process repeatability, which pose significant constraints for large-scale applications. Hence, future research should focus on three key directions: (1) deepening the understanding of multifield coupling mechanisms, including the interactions between mechanical forces, chemical etching, and energy fields (e.g., light, sound, and plasma), and establishing quantitative models of parameter synergy; (2) advancing intelligent control technologies, such as machine learning-based algorithms for real-time process optimization, and developing high-precision multifield coupling equipment to enhance process stability and consistency; and (3) promoting green and efficient processes, including the development of environmentally friendly chemical systems and energy-saving machining methods, as well as establishing standardized protocols for industrial implementation. The key innovation of this study is its systematic evaluation of polishing technologies and the identification of critical research directions to overcome diamond-machining challenges. By comprehensively assessing the strengths and limitations of existing methods, this study provides a solid foundation for the development of next-generation diamond-based ICs as well as offers valuable insights for academic researchers and industry professionals in advanced semiconductor manufacturing.

In the current era of industrial manufacturing and materials science, continuously enhancing material properties to meet the growing application challenges is an ongoing task. Metal materials play a key role in many industries because of their excellent mechanical properties and wide range of applications. Nevertheless, these metals are often subjected to wear, corrosion, and fatigue damage during practical use, which severely reduces their service life and reliability. Therefore, studying effective surface modification technologies that can improve the surface integrity and properties of metals has become a core issue in materials science research. Ultrasonic surface rolling processing (USRP) is an advanced material surface modification technology that combines ultrasonic energy and high-frequency mechanical vibrations to nano-strengthen the metal surface. This technology can cause plastic deformation on the surface of the material and significantly improve its surface integrity and mechanical properties. USRP can generate residual compressive stress on the surface of a material, effectively preventing the formation and expansion of cracks and reducing the permeability of the corrosive medium. In addition, this technology can form a nanostructured layer with a gradient grain size and orientation, thereby significantly enhancing the surface hardness and wear resistance of the material. This review summarizes the research progress in USRP in the fields of steel, aluminum alloy, titanium alloy, magnesium alloy, nickel alloy, and high-entropy alloy. It is demonstrated that these materials have achieved remarkable results in surface nano-strengthening and microstructural and performance improvement following USRP treatment. USRP technology can not only refine the grain size, reduce the surface roughness, and improve the surface hardness, but also convert the residual tensile stress into residual compressive stress to obtain a deeper nano-gradient hardened layer and residual compressive stress-affected area. This compensates for the low production efficiency of traditional mechanical processing methods as well as the mismatch between the working environment and performance requirements of high-performance materials. Finally, future application prospects and development directions of USRP are discussed. It is expected that focus will be placed on the refinement of theoretical models and the diversification of working methods. This research will further explore the theory of contact mechanics and surface integrity to develop a prediction model that can optimize the process parameters. In addition, USRP technology will be adapted to deal with complex parts and improve the efficiency and performance through multi-field coupling and process integration. The expansion of the application range will include composite materials and high-tech fields, including deep-sea exploration and aerospace satellites.

Mobile additive repair and remanufacturing in complex on-site environments face three overarching challenges: the multi-constrained nature of operational conditions and repair targets, discrete and highly variable quality domains of service-degraded materials, and demand for precise control and reliable assessment of repair quality in dynamically changing field scenarios. To address these challenges, this review examines the connotations, technical characteristics, and intrinsic difficulties associated with mobile additive repair and remanufacturing, with particular emphasis on the unique requirements of on-site operations. Drawing on recent developments and practical application cases, this article outlines the system composition, core modules, and functional architecture of mobile additive repair systems, including mobile deployment platforms, digital modeling and reconstruction tools, adaptive material-process subsystems, and multidimensional sensing and evaluation frameworks. By analyzing advances in design, materials, processes, and equipment, this review highlights the emergence of integrated mobile systems capable of operating in constrained spaces, interacting with heterogeneous surface states, and maintaining deposition stability under fluctuating environmental conditions. This study further analyses the main research directions and representative technical routes that shape the development of mobile additive repair technologies. These include environment-aware process planning strategies that consider geometric limitations, thermal boundary shifts, and accessibility constraints; material adaptation methodologies designed to accommodate substrate degradation, oxidation, or microstructural heterogeneity; and intelligent thermal and shielding control approaches that stabilize melt-pool behavior and improve layer quality in open or partially confined environments. Substantial progress has also been made in real-time monitoring and multiscale quality evaluation, where optical, infrared, acoustic, and laser-based sensing are increasingly combined to track dilution, defect initiation, interfacial bonding, and microstructure evolution during deposition. Based on these developments, this review identifies several key enabling technologies that enable reliable onsite additive repair of components located in special environments or within large-scale equipment that cannot be disassembled. Representative advances include portable and modular mobile repair platforms with enhanced environmental adaptability, digital twin-assisted repair workflow designs that link defect characterization with predictive simulation, and adaptive process control frameworks responsive to real-time disturbances. These innovations collectively form a new technical system that unifies design methodologies, material strategies, process optimization, equipment engineering, and closed-loop quality assurance. Across multiple industrial case studies, such integrated technical systems have demonstrated strong potential for delivering high-quality and efficient on-site repair of damaged components, ranging from turbine casings and reactor vessels to heavy machinery parts and aerospace structures. Commonly reported improvements include enhanced deposition uniformity in restricted or variable environments, stronger metallurgical bonding to service-degraded substrates, reduced incidence of common defects such as porosity or microcracks, and more predictable dimensional restoration with lower post-processing requirements. By consolidating these advances and mapping their interconnections, this review provides a coherent perspective on the evolution of mobile additive repair and remanufacturing technologies. Simultaneously, it identifies persistent scientific and engineering challenges—such as robust material-process matching for severely degraded substrates, more reliable prediction of repaired-component lifecycle performance, and further miniaturization and intelligent control of mobile platforms—that are likely to drive future research. Overall, this review summarizes the progress in establishing a new generation of mobile additive repair systems capable of providing high-quality, efficient, and reliable on-site restoration of critical components for the energy and chemical industries, heavy-duty equipment, and aerospace applications, and outlines the technological foundations required for continued advancement in this rapidly developing field.

阐述了徼纳米减摩自修复材料的分类、作用机理及研究现状,提出目前微纳米减摩自修复技术发展中的关键问题是建立准确的自修复评价方法及评价指标;合理解决微纳米颗粒在油性介质中的分散与稳定难题;根据设备的润滑工况选择合适的材料及使用工艺;深入开展自修复机理研究,进而实现磨损尺寸自修复等.

Novel intelligent lubricating materials and surfaces exhibit on-demand responsiveness and adaptability. The biomimetic self-regulating mechanism empowers in-service tribo-pairs with the autonomy to sense external environmental stimuli and adaptively modulate interfacial lubrication states. Such capabilities provide a groundbreaking solution for the “online sensing-decision-execution” intelligent transformation of advanced equipment in aerospace and defense sectors. Concurrently, the AI-driven intelligent inverse design of lubricating materials has revolutionized the traditional trial-and-error paradigm, enabling highly efficient and demand-responsive customization of lubrication for mechanical interfaces. This innovation provides a novel pathway for establishing a scientific framework for high-performance and high-reliability lubrication materials and surface systems capable of addressing diverse complex operational conditions. The intelligent evolution of lubricating materials and surfaces is progressively redefining the research paradigms in mechanical interface science, potentially unlocking breakthrough opportunities to advance frontier tribological theories and technologies. This paper discusses current research on self-lubricating, self-repairing, and self-diagnosing intelligent lubricating materials and surfaces, the frontier progress of AI-accelerated inverse design, and their future development trends, taking intelligent lubricating materials and surfaces and their AI paradigms as the pointcut. Currently, self-lubricating tribo-pairs that are environmentally robust and operationally adaptable use solid lubricating materials as the matrix, with liquid or solid-liquid-coupled lubricants as the dispersed phase. Effectively enhancing the interfacial lubrication performance can be achieved by releasing trace liquid lubricants to form fluid or boundary films. Two primary approaches are used for incorporating liquid lubricants into a tribo-pair matrix: porous-based self-storing and lubricating strategies and capsule-based self-storing and lubricating strategies. The development of capsule-based self-storage and lubrication techniques makes it a novel solid superlubrication method after carbon-based superlubrication and two-dimensional material superlubrication. This method enables macroscopic superlubrication at temperatures between 0 and 250 ℃. Although intelligent capsule-based self-storing and lubricating technologies can significantly reduce friction and wear on tribo-pair surfaces, material degradation and surface damage are inevitable during prolonged service. It is important to promptly repair wear and damage to improve the wear resistance and service life of tribo-pair materials. Intelligent surface healing technologies for tribo-pairs can be broadly categorized into extrinsic and intrinsic types. Extrinsic repair typically employs stimulus-responsive materials (for example, microcapsules or microvascular networks) to encapsulate active repair agents that are autonomously released upon external stimulus-induced damage, thereby facilitating physicochemical reactions for localized repair. Intrinsic repair leverages the reversible reorganization of dynamic covalent bonds (for example, Diels-Alder (DA) bonds, acylhydrazone bonds, and disulfide bonds) or non-covalent interactions (for example, hydrogen bonds, metal-ligand coordination, and host-guest interactions) to enable autonomous damage repair. Moreover, excessive wear on tribo-pair surfaces generates clearance, and its enlargement exacerbates vibration during equipment operation and reduces service life. Thus, it is imperative to endow tribo-pairs with self-diagnostic capabilities for real-time monitoring of wear locations and damage severity, enabling intelligent lifecycle management and predictive maintenance of equipment. Three approaches are the primary focus of the current intelligent self-diagnostic technologies: dye-based chromatic detection, electrical signal diagnostics, and optical signal diagnostics. The latest paradigm in the research and development of lubricating materials and surfaces, driven by AI, is the fourth paradigm after empirical, theoretical, and computational science paradigms. The primary technical approach involves employing machine-learning models to establish potential mapping relationships between the properties (such as composition and structure) of lubricant materials and surfaces and their lubrication performance. This enables prediction of the lubrication performance of new materials and surfaces. Furthermore, by integrating optimization algorithms or deep-reinforcement-learning techniques, global optimization within the high-dimensional nonlinear design space of lubricant materials and surfaces can be achieved rapidly, thereby facilitating the efficient inverse design of materials and surfaces with target attributes. This transformative research paradigm is expected to decipher the lubrication and friction reduction mechanisms at mechanical interfaces, overcome the efficiency limitations of traditional trial-and-error iterative methods, and ultimately realize demand-driven customization of lubricant materials and surface designs.

The structure of BCN amorphous nano-films were studied by XPS. The characteristic peak of three elements of Ar, contamination carbon and deposited monolayer Au were considered as reference peak to correct the shift of the XPS spectra caused by charging effect during the XPS analysis process, and the results of XPS and FTIR analyses were compared to estimate the correctness of this method. The investigation results indicated that the calculated binding energy of BCN film depends on reference peak selection, and the correct structures can be obtained when the bonding energy was adjusted by selecting appropriate characteristic peak. The bonding structures of films corrected by Ar are quite similar with the results of FTIR analysis. This method is suitable for analyzing BCN films prepared in Ar-contained sputtering atmosphere, and is also suitable for analyzing the inner structure of films. There is an obvious deviation in bonding energies between the true value and adjusted by contamination carbon or by deposited monolayer Au.

As the cornerstone of the digital economy, chips are advancing toward integration, low power consumption, intelligence, and functionality. Chemical-mechanical polishing (CMP) has become a critical technology for achieving ultrasmooth and defect-free global and local planarization in chip manufacturing. The abrasives in polishing slurry act as a “bridge” to facilitate the synergistic mechanical and chemical processes that are essential for high-precision material removal. Moreover, abrasives play crucial roles in achieving efficient, atomic-level, and smooth manufacturing of various materials, and they have become focal points of CMP research. Over the past few years, extensive efforts have been devoted to developing high-performance abrasives for chip manufacturing. In addition to being integral to the mechanical aspects of CMP, where they perform the physical removal of materials, abrasives also contribute chemically by interacting with the materials being polished. Hence, CMP performance is significantly influenced by the properties of the abrasives, including their dispersion stability, mechanical properties, morphology, particle size, and chemical reactivity. Maintaining the dispersion stability of abrasives is vital for prolonging the shelf lives of polishing slurries and minimizing defects, such as scratches. Furthermore, precise control over the morphology and size distribution of the abrasives can significantly reduce scratches on polished surfaces. Chemically reactive abrasives enable efficient material removal, which improves the overall polishing rate and surface quality. The research progress on typical abrasives used in CMP for semiconductor manufacturing is reviewed, with a focus on materials such as SiO₂, Al₂O₃, CeO₂, and diamond. SiO₂ abrasives are especially renowned for their abilities to satisfy the ultra-high-precision surface quality requirements of advanced semiconductor devices as well as their versatility across a wide range of materials and processing conditions. SiO₂ abrasives are essential for the manufacturing of modern electronics, particularly for applications that require exceptionally smooth and defect-free surfaces. Al₂O₃ abrasives are widely used in the CMP of substrates such as SiC, GaN, and sapphire, and they contribute to a favorable balance between performance and cost. CeO₂ abrasives are highly effective for achieving efficient material removal and fine surface finishes owing to their unique combination of mechanical hardness and chemical reactivity, which makes them ideal for specialized CMP applications. Diamond abrasives are essential for planarizing ultra-hard materials, including diamonds and other hard substrates, for which conventional abrasives are ineffective. In addition to these conventional abrasives, there is growing interest in novel abrasives and the integration of energy-field-assisted polishing techniques. These techniques utilize external energy fields (such as electric, magnetic, or optical fields) to enhance the physical and chemical interactions between abrasives and substrates, thus helping overcome the limitations of conventional abrasives when working with hard or chemically inert materials by providing an additional energy input. Moreover, there is ongoing research on the behavior of abrasives at the nanoscale, as semiconductor manufacturing is advancing toward smaller and more complex devices. Advanced characterization techniques and computational simulations were also used to gain a deeper understanding of the CMP process at the nanoscale, with the aim of understanding the atomic-level interactions between abrasives and substrates. Improving the precision and efficiency of the CMP processes is crucial, particularly for the production of next-generation semiconductor devices. Additionally, a forward-looking outlook on the application of abrasives in chip CMP is provided, and the needs for continued process optimization and the development of novel abrasives are emphasized. Furthermore, the theoretical mechanisms that govern CMP behavior must continue to be explored, as this will provide a strong foundation for future innovation in the field. This study aims to provide valuable insights and theoretical support to guide future research and development in CMP for the purpose of ultimately driving advancements in semiconductor manufacturing technology.

The precise modulation of adhesion properties on superhydrophobic surfaces is recognized as a critical pathway for advancing functional surface engineering, with extensive applications in mechanical, aerospace, and biomedical engineering. In this context, the adhesion behavior of water droplets interacting with engineered surfaces is systematically summarized, with particular emphasis on the influence of surface microstructures, chemical compositions, and external stimulation on the adhesion of superhydrophobic surfaces. By drawing inspiration from natural superhydrophobic biological systems, such as lotus leaves, rose petals, and butterfly wings, which exhibit tailored adhesion properties, the fundamental mechanisms underlying solid-liquid adhesion behavior are elucidated, and advanced strategies for its modulation are developed. Currently, advanced characterization techniques have been standardized to quantify adhesion forces and validate modulatory mechanisms between solid and liquid. Contact angle (CA) measuring instrument systems are utilized to measure the minimum angle at which a water droplet begins to slide on an inclined surface, with a high-speed camera capturing dynamic water droplet behaviors during sliding. Adhesion measuring instruments coupled with a high-speed camera enable the nanoscale mapping of adhesion forces under controlled water droplet volume and speed of motion of the carrier table conditions. In addition, computational fluid dynamics (CFD) simulations are employed to model the solid-liquid interactions, providing insights into the mechanisms affecting adhesion on the superhydrophobic surfaces. The adhesion behavior between solid and liquid is primarily governed by the surface microstructures and chemical composition. The surface microstructures with different shapes are fabricated through laser irradiation, template replication, or lithography technologies. For instance, microstructures with various geometries are fabricated through precise adjustments of laser processing parameters, such as energy density, scanning pitch, and scanning speed, to enhance air entrapment and minimize solid-liquid contact areas. Concurrently, densely arranged micropillar arrays or porous networks are designed to change the solid-liquid contact state, enabling controlled water droplet pinning or directional transport. In addition, the transformation between low-adhesion superhydrophobic surfaces and high-adhesion superhydrophobic surfaces is further modulated by changing the chemical composition of the surface. Self-assembled monolayers (SAMs) terminated with fluorinated groups or silane derivatives are uniformly applied to reduce the surface energy, integrating stimuli-responsive polymers, such as pH-sensitive polyelectrolytes or thermoresponsive poly(N-isopropylacrylamide) (PNIPAM), to enable dynamic adhesion transitions. A synergistic combination of structural patterning and chemical modification is demonstrated to generate adhesion patterns for programmable water droplet manipulation, as exemplified by spatially selective plasma etching followed by region-specific silanization. Furthermore, external stimulation, including light irradiation, magnetic fields, and temperature variations, is employed to achieve reversible and real-time modulation of adhesion on the superhydrophobic surfaces. Photoresponsive surfaces embedded with azobenzene derivatives or titanium dioxide (TiO₂) nanoparticles are engineered to undergo light-triggered adhesion transforms. Under ultraviolet (UV) illumination, azobenzene-modified surfaces exhibit cis-trans isomerization, which alters the adhesion properties, whereas TiO₂-coated surfaces leverage photocatalytic decomposition to remove hydrophobic layers, enabling dynamic switching between low and high adhesion states. Similarly, thermoresponsive coatings are designed to undergo hydrophilic and hydrophobic transitions above specific critical temperatures, thereby facilitating temperature-dependent adhesion control. Magnetic field-responsive superhydrophobic surfaces are constructed by embedding ferrofluids or paramagnetic particles into superhydrophobic matrices, which allows noncontact water droplet manipulation through external magnetic gradients. The method of modulating surface adhesion through electric fields has been developed to modulate the solid-liquid contact state via applied voltages, achieving precise solid-liquid adhesion transformation. Practical implementation of tunable adhesion superhydrophobic surfaces is demonstrated across diverse domains. In microfluidic systems, programmable adhesion gradients have been engineered to guide water droplet routing for high-throughput bioassays, whereas ice-phobic superhydrophobic surfaces with tunable adhesion have been developed to mitigate ice accretion on aerospace components. Self-cleaning technologies exploit low-adhesion superhydrophobic surfaces to achieve contaminant removal by sliding water droplets, whereas high-adhesion superhydrophobic surfaces are tailored for targeted drug delivery, thereby enabling the non-destructive release of site-specific therapeutic agents. This review emphasizes the importance of research on the mechanisms and methodologies of adhesion modulation on superhydrophobic surfaces. By addressing the existing challenges and integrating emerging technologies, the development of tunable adhesion superhydrophobic surfaces exhibits excellent prospects for advancing developments across various scientific and engineering disciplines.

Nanostructured and conventional WC-I 2Co coatings were prepared by HVOF spraying. The properties of adhesion, hardness and erosion resistance of two coatings were investigated. The characterizations of spraying powders, microstructure and surface morphology of coatings were analyzed by SEM. The results indicated that nanostructured WC 12Co coating showed better properties not only in density and hardness but also in distribution of WC and resistance of erosion than that of conventional. Micohardness reached to 1610 HV, aboutl.5 times that of conventional coating. Erosion rate reduced about half of the rate of conventional coating.

Thermal barrier coatings serve as a prevalent advanced heat protection method in aviation engines. The working environment for the coatings becomes increasingly challenging with a rise in engine operating temperatures. Investigating the failure modes of the coatings under high-temperature and high-temperature gradient conditions is essential to improve the operational lifespan of the coatings. A ceramic coating with a thickness of 0.12 mm, comprised of Gd₂O₃-Yb₂O₃-Y₂O₃ co-doped ZrO₂, was produced on the GH3536 substrate using the atmospheric plasma spraying technique. A burner rig test device has been designed to simulate the service environment of coatings. This generates a super high-temperature flame by burning a mixture of aviation kerosene and oxygen, ensuring high temperatures on the sample surface. The sample is of a hollow structure with high-pressure cooling water flowing inside, which ensures low temperatures on the back of the sample, thus generating a severe temperature gradient. The use of various characterization methods allowed for an analysis of the microstructural changes in the coating, leading to a discussion of the failure mechanisms of the coating under high temperature and high temperature gradient conditions. The results show that after burner rig test with surface temperature of about 2350 ℃, the coating life of single long-time test is greater than 1200 s, and the coating life of multiple short-time test is 3 times. The coating showed obvious gradient sintering along the thickness direction. The top area of the coating is heavily sintered, which is called the sintered zone, and the porosity and grain size are distributed in gradient along the thickness direction. After multiple 25 s tests, there was an observed increase in the depth of the sintered zone, a higher quantity of vertical cracks, and an expansion in both the width and length of transverse cracks as the number of tests increased. Furthermore, the thermal growth oxide (TGO) transitioned gradually from alumina to spinel, and there was an expansion of the micro-transverse cracks formed by TGO. After the 1200 s test, the coating maintained a singular cubic phase and demonstrated excellent stability at high temperatures. In contrast to the single 25 s test, the sintering depth increased, leading to a higher number of vertical cracks. However, the quantity of transverse cracks remained consistent, confirming that transverse cracks arise from thermal-mismatch stress during repetitive thermal shock processes. In summary, the failure of the coating under high temperature and high temperature gradient conditions can be attributed to a combination of high-temperature sintering, thermal-mismatch stress, and TGO. The failure process can be summarized as the rapid propagation of early-stage vertical cracks caused by high-temperature sintering, the generation of intermittent transverse cracks at the interface due to thermal mismatch stress. The micro-transverse cracks produced by the thermal growth oxide connect the intermittent transverse cracks at the interface, and the connection through the vertical cracks and the continuous transverse cracks causes the coating to finally fall off. Failures occur earlier and the failure mechanism is more complex under high temperature and high-temperature gradient conditions compared to that in conventional thermal shock tests. The research results provide some support for the development of new thermal barrier coatings. The premature failure of coatings can be alleviated by improving the sintering resistance of coatings, increasing the thickness of coatings appropriately and designing multilayer structures.

The advancement of technology in today’s society has led to higher performance demands for machining tools, and tool coatings have become a primary method for enhancing tool performance. To fully exploit the inherent properties of coated tools, post-treatment is essential. This paper aims to summarize the commonly used post-treatment methods for coated tools, which include sandblasting, polishing, heat treatment, energy field / beam treatments, and others. Sandblasting is the most widely used post-treatment method for coatings. The effectiveness of the post-blasting treatment is determined by three key parameters: grit, pressure, and time. Careful analysis of these variables shows that sandblasting can efficiently remove larger particles from the coated surface while enhancing its overall quality, provided that appropriate conditions are met. Another traditional surface-polishing technique is mechanical polishing, which uses flexible polishing tools, abrasive particles, and other media to modify the workpiece surface. This process effectively removes burrs and larger particles, resulting in a significant reduction in surface roughness. Both sandblasting and mechanical polishing contribute to achieving finer surface finishes on coated materials. Heat treatment is another widely adopted method for both tool treatment and post-treatment of coated tools. During the deposition of tool coatings, the substrate temperature remains low, causing rapid cooling of the coating material. Due to differences in the thermal expansion coefficients between the grains within the coating, thermal stress arises, which can accelerate tool failure. Heat treatment plays a crucial role in relieving some of the strain energy within the coating, adjusting the state of the coating-substrate interface, enhancing microstructural properties, and ultimately improving the performance of coated tools. A recent advancement in post-treatment methods for coatings is the use of energy fields or beam treatments. Energy field treatments include various techniques such as magnetic fields, electron beams, ion beams, lasers, and other similar methods. Compared to mechanical and heat treatments, energy field treatments offer greater controllability and a broader range of action. Research indicates that applying different energy field parameters during post-treatment can enhance not only the surface integrity of the coating but also the bonding strength between the coating and the underlying substrate. This technique involves localized heating of specific areas on the coating using high-density energy, leading to surface remelting and changes in roughness. Additionally, rapid heating and the ensuing energy waves generate thermal stress, which strengthens the coating, substrate, and bonding interfaces. As a result, this process significantly enhances the bonding strength between the coating and the substrate, thereby improving the overall performance of the coating.Although progress has been made in the post-treatment of coated tools, these methods are not yet widely applied in practice, with the exception of polishing. By analyzing the advantages and disadvantages of each post-treatment method, this study clarifies their respective scopes of application, addresses the fragmentation of research in this field, improves understanding of post-treatment methods for tool coatings, and provides a useful reference for the future development of post-treatment technology for coated tools.

As one of the most popular advanced functional ceramics, silicon carbide (SiC) has many excellent characteristics, such as low coefficient of expansion, high thermal conductivity, and radiation resistance. In recent years, brake materials prepared using SiC have been widely used in braking systems such as cars and aircraft. However, owing to its high hardness, SiC is difficult to process using conventional methods. At the same time, the intrinsic hydrophilic characteristics of SiC make its surface prone to fouling and icing. This not only shortens the service life of the material and reduces its utilization efficiency and braking performance but also poses potential safety hazards. These issues limit the broader application of SiC in various fields. Therefore, improving the surface properties of SiC materials through composite processing has become the key to broadening their applications. In this study, a laser-chemical composite processing method was developed to fabricate superhydrophobic SiC surface. First, regular hexagonal and smooth quadrilateral periodic micro-nanostructures were constructed on the surface of SiC materials by nanosecond laser ablation. Subsequently, superhydrophobic surfaces were successfully prepared by further silane-ethanol mixed solution modification and heat treatment. The surface morphology of superhydrophobic SiC materials was characterized by laser confocal microscopy and scanning electron microscopy, and the surface chemical composition was analyzed using energy-dispersive spectrometry and X-ray photoelectron spectroscopy. Furthermore, the influence of the surface structure and surface chemistry on wettability was clarified. Experimental results demonstrated that the surface roughness of the SiC material treated by the composite process increased significantly, forming a regular groove structure. As the laser scanning rate decreased, the depth of the surface grooves gradually increased. This reduction in air retention led to a decrease in the contact area between the water droplets and material surface, thereby affecting the surface wettability. Within a certain range, with the decreases in the laser scanning rate and scanning pitch, the surface wettability was improved, resulting in a composite Wenzel-Cassie state. The maximum contact angle of the material surface was 156.4°, and the minimum rolling angle was 1.3°. The O content on the surface of the untreated SiC material was 2.75%, and the functional groups of C-C and C-Si were the main components. After laser processing, the O content rapidly increased to 28.83%, resulting in a large number of C=O and Si-O-Si functional groups. After laser-chemical composite processing treatment, O accounted for 17.04% of the chemical components on the surface. Simultaneously, a large number of hydrophilic groups, such as C=O and C-O, were decomposed and broken. In addition, the distribution density of Si was notably different. Hydrophilic groups, such as C=O and C-O, were decomposed and fractured, resulting in the formation of a large number of hydrophobic functional groups, such as Si-O-Si. The surface of the superhydrophobic SiC material exhibited several enhanced functional properties. First, its surface could delay icing for over 250 s. Second, its corrosion resistance was significantly improved. Finally, it exhibited excellent self-cleaning performance. Moreover, compared with the smooth quadrilateral structure, the surface roughness of the regular hexagonal micro-nano structure was increased by more than 3 μm. The surface had a more obvious fence structure, and the ability of the grinding wheel to resist cyclic friction was increased by four times. The icing time was delayed by an additional 40 s, and it was completely frozen into ice droplets at 280 s. Therefore, the application requirements of the brake disc were satisfied. As demonstrated by the performance characterization experiments, the surface of the superhydrophobic SiC material exhibited excellent self-cleaning capability, corrosion resistance, icing resistance, and wear resistance. These properties indicate that the laser-chemical composite processing method can be used to prepare superhydrophobic SiC surfaces with stable performance. Ultimately, this process provides a theoretical and practical approach for the preparation of SiC material surfaces with desirable properties, thereby satisfying the application requirements of SiC brake pads. This study utilized fluorine-free chemical reagents, which are known for their low environmental impact and reduced costs. This approach is expected to further establish a foundation for the laser functionalization of SiC materials. It also has the potential to expand the scientific research and engineering applications of SiC materials in various fields.

As the dimensional scaling and functional integration of high-end semiconductor devices accelerate, ultra-precision finishing of substrates such as monocrystalline Si, SiC, AlN, Ga₂O₃, and GaN is now constrained by atomic-level accuracy targets; while this context motivates the field, the present review concentrates on what enables—and limits—atomic-level grinding (ALG) as a deterministic route for planarization and thinning of semiconductor wafers, synthesizing mechanism-level knowledge with process engineering practice to clarify how ALG governs surface integrity, subsurface damage (SSD), total thickness variation (TTV), and mid-spatial-frequency (MSF) errors that ultimately control device yield and performance. We first dissect material-removal mechanisms from the atomic to the mesoscale and explain how ductile-regime grinding can be stabilized by connecting lattice bonding, elastic-plastic anisotropy, fracture resistance, and tribochemistry with the thermomechanical fields at the tool-work interface: for Si, pressure-induced phase transformation and subsequent tribo-oxidation support ultra-smooth shearing of a metastable / altered layer; for SiC, amorphization under high contact stress combined with oxidation-assisted weakening suppresses brittle fracture and enables Å-level topographies; for III-N and ultra-wide-bandgap oxides (GaN, AlN, Ga₂O₃), defect-mediated shear coupled with chemistry- or field-assisted bond weakening—via alkaline or oxidative chemistries and hydration reactions—reduces the effective activation energy for interfacial slip. Across materials, we highlight controlling nondimensional groups, particularly the ratio of undeformed chip thickness to the critical depth for ductile removal, that demarcate transitions among brittle chipping, quasi-ductile ploughing, and true ductile cutting, yielding mechanism maps that relate abrasive size and morphology, contact pressure, temperature, and chemistry to SSD depth, residual stress, and roughness. Building on these mechanisms, we catalog processing strategies and system-integration choices that operationalize ALG at wafer scale: fixed-abrasive ultra-fine diamond grinding with electrolytic inprocess dressing (ELID), ultrasonic-vibration-assisted modes that lower effective cutting forces, and laser / thermal assistance that locally softens the surface to tip the balance toward plasticity; chemo-mechanical synergy using oxidants, complexants, and pH / redox control to form and continuously renew a weak interfacial layer that can be sheared at nanometric depths of cut; and co-design of tooling and kinematics—resin / metal / ceramic bonds, abrasive size distributions, wheel-topography conditioning, and path planning (spiral / raster with dwell control)—to suppress TTV and MSF on 200-300 mm wafers. We summarize robust process windows from successful reports—high wheel speed, low feed and depth to keep the undeformed chip thickness sub-critical, ultra-stiff low-runout spindles, temperature-stabilized machine / wafer stacks, and low-noise workholding to prevent chatter—while analyzing fluid chemistry as a lever that intersects with frictional heating and contact time to regulate altered-layer thickness and face-dependent removal selectivity. Metrology and control are treated as first-class topics: in-situ force / acoustic- emission / temperature sensing for contact-state identification; optical interferometry for shape and MSF; and XPS / TEM / Raman for altered-layer chemistry and SSD, all feeding model-based and data-driven control frameworks that span multiscale simulation (DFT / MD to continuum) for predicting critical depths and stress fields, physics-informed machine learning for tuning parameters to minimize SSD at target MRR, and digital twins that couple thermal-structural drift, wheel-wear evolution, and wafer geometry for adaptive compensation of TTV and edge roll-off. From this synthesis, we make explicit the principal challenges: robust suppression of brittle events on hard, chemically inert wafers without sacrificing throughput; quantitative control of SSD at tens of nanometers or less with verifiable, crystallographic-face-dependent selectivity; wafer-scale flatness and TTV control during thinning, including edge roll-off mitigation; MSF management induced by periodic wheel topography or path artifacts; tool wear, self-sharpening, and wheel-state observability; thermal and dynamic stability of large, low-stiffness wafer stacks; seamless integration with downstream CMP without re-introducing defects; and greener chemistries that maintain mechanochemical efficacy. Finally, we identify emerging directions likely to be most impactful: hybrid energy fields (ultrasonic / laser / plasma-assisted ALG) to expand the ductile window; closed-loop, sensor-rich control with real-time detection of critical-depth excursions; physics-guided AI for multi-objective optimization of roughness / SSD / MRR subject to throughput and sustainability constraints; micro- / nano-textured abrasive tools that engineer contact states and chip evacuation; and standardized protocols plus open datasets for cross-material benchmarking. Collectively, the review delivers mechanism maps, process-integration guidelines, and a research agenda aimed at deterministic attainment of sub-nanometer roughness and minimal SSD in semiconductor substrate grinding, offering theoretical insights and technical references to guide future advancements in atomic-level grinding for semiconductor manufacturing.

This paper introduced the research and application of double glow plasma discharge technologies, including single- element discharge, multi-element discharge and complex discharge. The results showed that the double glow plasma discharge technology can improve greatly the wear-resistance, corrosion-resistance and anti-oxidation of components and prolong their service life, this technology can play an important role in energy and materials-saving, environment-protection, as well as cost-reducing.

Based on the background of the anticipated Industry 4.0 era, the promotion of “Made in China 2025” and the strategy of maritime power, traditional marine anti-fouling coating materials have gradually withdrawn from the historical stage and been replaced by new biomimetic and intelligent marine anti-fouling coating materials. However, a comprehensive and systematic review of new biomimetic and intelligent marine anti-fouling coating materials is still lacking. Therefore, this study reviews the research progress of biomimetic anti-fouling coating materials constructed by biomimetic anti-fouling strategies, such as micro-nanostructure surface, release of green anti-fouling agent, super-slippery surface, dynamic surface, and self-healing. Meanwhile, the research progress of intelligent anti-fouling coating materials formed by intelligent anti-fouling strategies, such as pH, temperature, and light response control, is reviewed. The research progress of synergistic anti-fouling coating materials constructed by the synergistic anti-fouling strategies, namely the combination of biomimetic and intelligent anti-fouling strategies, is also reviewed. Finally, the preparation methods, anti-fouling mechanisms, effects, advantages and disadvantages, and the development trends of the above coating materials are summarized. The emerging biomimetic and intelligent marine anti-fouling coating technology are currently recognized in marine anti-fouling, and has achieved good research results; however, some problems are yet to be resolved. For example, the toxic components of current coating materials have uncertainties and potential risks to the growth and reproduction of marine organisms and marine ecosystems; the surface structure of biomimetic anti-fouling coating is complex; weak anti-fouling durability, stability, and high cost. The response of intelligent anti-fouling coating to external conditions is singular; the anti-fouling stability is not high, and the intelligent anti-fouling evaluation system and mechanism are unclear. Other issues include multi-strategy combined anti-fouling coatings and limited research on the synergistic anti-fouling mechanism between various strategies. Furthermore, the future development direction of anti-fouling coating materials constructed by biomimetic and intelligent multi-antifouling strategies is suggested. In selecting coating materials, the marine environment affinity components are used to replace the toxic components to reduce the risk of toxic substance release into the marine environment; adhering to the principle of "from the ocean, to the ocean" vigorously tap the marine biological resources, extract or synthesize new and efficient bio-antifouling agents to block the related signals and metabolic pathways of fouling organisms to inhibit the deposition and attachment of fouling organisms, rather than direct poisoning, thereby reducing the genetic risk to marine organisms; strengthening the basic research of bionics and biomimetic technology, and studying the microstructure surface, metabolism, and release law and stress behavior of anti-fouling attached organisms to quickly improve the overall design level of biomimetic anti-fouling coating; an intelligent “on-off” anti-fouling system with multiple conditional response was designed, which meets the requirements of convenient and accessible practical application environment and can quickly start and stop according to the specific environment, promoting the broad application of biomimetic and intelligent marine anti-fouling coating materials; increasing the research of multi-strategy combined anti-fouling method systems, such as expanding various anti-fouling strategies and an in-depth study of the synergistic anti-fouling mechanism between various strategies to solve the problem of a single anti-fouling strategy failing to meet the requirements of long-term, stable anti-fouling in the actual complex marine environment, thus ensuring long-term stable and efficient anti-fouling of coating materials. The multi-strategy combined anti-fouling method system will become an important development trend in marine anti-fouling in the future. This study mainly proposes the guiding viewpoint of the method system of the synergistic effect of biomimetic and intelligent multi-antifouling strategies, addressing the issue of limited review articles in the industry. Given the continuous progress of science and technology, the multi-strategy joint anti-fouling method system is expected to promote new breakthroughs in the marine anti-fouling industry in China. Biomimetic and intelligent marine anti-fouling coating materials will become a major development direction of marine anti-fouling in the future. In addition, they have important reference value for the development of national defense and military, marine engineering, maritime transportation, marine fishery, and other fields.

Within the orbital altitude range of 180 km to 650 km, oxygen molecules in the atmosphere tend to decompose into atomic oxygen when exposed to ultraviolet light. Due to its strong oxidizability, atomic oxygen, is capable of causing erosion effects on the surface materials of spacecraft. Complex structural evolutions, such as mass loss, thickness reduction, and changes in surface morphology are involved in this process. So that performance degradation inevitably occurs, highlighting the importance of protecting the surface materials of low-orbit spacecrafts. The adoption of protective coatings is an effective way to improve the atomic oxygen protection performance of materials and ensure the long lifespan and high reliability of low-orbit spacecraft. The research progress of atomic oxygen protective coatings is briefly reviewed, and the factors affecting the performance of atomic oxygen protective coatings are studied. The results show that surface roughness, defects composition and structure of the coating have significant influences on its atomic oxygen protection effect. A rough surface of the coating has advantage in increasing the probability of collisions between atomic oxygen and surface materials, while defects in the coating provide more channels for atomic oxygen and enhance the erosion effects, and the composition and structure of the coating will affect the probability of atomic oxygen reactions. The types of space atomic oxygen protective coatings are investigated, and the characteristics of different types of coatings are analyzed. Atomic oxygen protective coatings can be divided into inorganic coatings, organosilicon coatings, and composite structure coatings. Among them, inorganic coatings are generally solid oxides with a dense structure, and this type of coatings has excellent protective performance but poor flexibility. Organosilicon coatings are mainly composed of elements such as Si, H, C, and O. Good flexibility is achieved through the formation of a polymer-like network structure in organosilicon coatings. When eroded by atomic oxygen, a dense silicon oxide layer appears during the reaction between atomic oxygen and Si atoms located at the surface of coatings, which prevents further erosion. However, under the action of high flux atomic oxygen, the coating surface is prone to shrinkage, resulting in a “tiled” surface and coating cracking. The composite structure atomic oxygen protective coatings can make up for the shortcomings of single-structure coatings and adapt to the needs of different application conditions, however, the performance of this type of coatings is highly correlated with their structure and requires. The coating preparation methods are sorted and summarized, while the advantages / disadvantages and application objects of different preparation techniques are analyzed based on a comprehensive comparison: inorganic coatings with dense morphology can be obtained through magnetron sputtering process, which is mainly suitable for preparing coatings / films on rigid or semi-rigid substrates. Plasma-enhanced chemical vapor deposition in coating preparation corresponds to lower deposition temperature, less thermal damage to substrates. And a wider application range because both inorganic coatings and organic coatings can be achieved in this way. However, due to process limitations, this technology can only be applied to planar substrates and cannot be applied to three-dimensional complex structural parts; ion beam co-deposition can conveniently prepare multi-component composite structure coatings, so it is the main preparation technology for composite atomic oxygen protective coatings; atomic layer deposition has precise coating thickness control, a dense coating structure, no pinholes and other defects, and can form a uniform film on the substrate surface with complex configurations such as steps and grooves. Moreover, it can repair the defects on the substrate surface, therefore having obvious advantages in atomic oxygen protection and achieving good atomic oxygen protection performance at a relatively thin thickness. However, the disadvantage is the low deposition rate, low efficiency, and high stress when preparing thick coatings. Cracks are prone to occur when applied on flexible substrate surfaces. The sol-gel method for preparing coating materials has a low temperature during the process, uniform coating structure, easy control of the reaction process, and low cost. However, in general, the coating thickness is relatively high, requiring tens of microns or more and high quality, which is not conducive to the light weighting of spacecraft. Therefore, it is mainly applied to small structural parts. The precursor photolysis / hydrothermal curing method requires post-treatment such as irradiation and heating when preparing coatings, and the uniformity control is more difficult when implemented on a large area. Therefore, it is suitable for local coating and repair of easily damaged areas on the surface of structural parts. The further development trend of atomic oxygen protective coatings is analyzed and introduced. The research provides the necessary research basis and reference for the atomic oxygen protection of materials for low-orbit spacecraft in China and provides research ideas for the further development of atomic oxygen protective coating technology.

With the continuous advancement of technology, the requirements for the processing accuracy of optical components in fields such as advanced optics and integrated circuits have gradually increased. From the initial nanometer-level precision to the current pursuit of sub-nanometer-level precision, this transition represents not only an extreme challenge to technology but also necessary support for the future development of science and technology. However, faced with such stringent requirements, current mainstream traditional processing technologies, such as chemical mechanical polishing (CMP), fluid jet polishing (FJP), magnetorheological finishing (MRF), and ion beam polishing (IBP), despite their significant application effects in their respective fields, all have insurmountable limitations. These traditional technologies often struggle to achieve the goal of manufacturing atomically smooth surfaces while ensuring high efficiency. Therefore, manufacturing optical components with sub-nanometer roughness and low subsurface damage while ensuring processing efficiency has become a critical technical challenge in the field of ultraprecision manufacturing that must be urgently addressed. In this context, gas cluster ion beam (GCIB) technology, as an innovation and upgrade to traditional ion beam technology, is gradually emerging in the field of ultraprecision processing owing to its unique processing mechanism and excellent performance, demonstrating significant application potential. Therefore, it is necessary to discuss the principles, irradiation characteristics, and potential applications of GCIB technology. Herein, first, the principles of GCIB technology are explained, and the unique irradiation characteristics of GCIB technology are elaborated. GCIB is an ion beam processing technology based on gas clusters, which are tiny clusters composed of tens to thousands of atoms or molecules. This technology first condenses gas molecules into microclusters through supersonic expansion and then forms an uncharged GCIB through ionization, acceleration, focusing, and neutralization. During processing, these ions strike the workpiece surface at a certain speed and remove the material through physical sputtering to achieve polishing, etching, and other purposes. Compared with traditional ion beam technology, GCIB technology has a series of unique irradiation characteristics that endow it with significant advantages in the field of ultraprecision processing, such as low energy per atom, high sputtering yield, lateral sputtering effect, and dense energy deposition. Based on these characteristics, GCIB technology has broad application prospects in fields such as polishing, etching, thin-film deposition, and secondary ion mass spectrometry (SIMS). To systematically study GCIB technology, this research summarizes its application status in different fields. In the field of polishing, utilizing the low-energy and high sputtering yield characteristics of GCIB enables high-precision surface polishing. In the field of etching, GCIB technology exhibits excellent etching accuracy and controllability, enabling precise etching at the micrometer or even nanometer scale. In the field of thin-film deposition, precise deposition of various types of thin films can be achieved by adjusting parameters such as the composition and energy of GCIB. This deposition method not only has high deposition rates and uniformity but also enables precise control and modification of the films. In the field of SIMS, GCIB technology can also be used as an excitation source to analyze the elemental composition and distribution of materials. Finally, this research discusses the shortcomings and future development directions of GCIB technology. As an emerging technology, existing research has only validated the effectiveness of GCIB technology in laboratory environments and has not proven the feasibility of GCIB processes in actual manufacturing. Additionally, the production cost of GCIB equipment is relatively high, and while its processing efficiency is better than that of IBP, it is still lower than those of CMP and MRF. Therefore, future efforts are still needed to optimize equipment, reduce costs, and improve processing efficiency.

Ultraprecision surface grinding and polishing are crucial for manufacturing high-end aluminum nitride (AlN)-based wide-bandgap semiconductor chips and devices. When traditional ultra-precision surface processing methods such as nanogrinding are used to process AlN, the material removal rate is low, and processing-induced damage is difficult to control owing to the hard-brittle properties of AlN. It has been proven that inducing ultrasonic vibrations can increase the material removal rate and reduce subsurface damage during grinding. However, the material-removal mechanisms of ultrasonic vibration-assisted nanogrinding of AlN are not completely understood, and the influencing law and microscopic mechanisms of amplitude and frequency remain unclear. To this end, molecular dynamics simulations of ultrasonic vibration-assisted nanogrinding of AlN surfaces with single diamond abrasives under different conditions were performed to investigate the influence of amplitude and frequency on the removal of nanoscale / sub-nanoscale materials and subsurface lattice damage at the atomic level. The Vashishta potential function was used to describe the interatomic interactions within the AlN workpiece, and the Lennard-Jones potential function was used to describe the C-Al and C-N interactions between the diamond abrasives and the AlN workpiece. The microstructure of the AlN workpiece during nanogrinding was characterized by the dislocation extraction algorithm (DXA) and identify diamond structure (IDS) to discuss the effects of amplitude and frequency on subsurface lattice damage such as dislocations, stacking faults, and amorphization. Based on a comprehensive analysis of the data of the grinding force, grinding morphology, removal volume, subsurface microstructures, temperature distribution, and von Mises stress distribution, the mechanism of ultrasonic vibration-assisted nanogrinding under different amplitude and frequency conditions on the nanoscale / sub-nanoscale material removal and subsurface lattice damage at the atomic level was explored. The simulation results demonstrate that both amplitude and frequency significantly affect the grinding force, and the instantaneous tangential and normal contact areas between the diamond abrasives and AlN workpieces during nano-grinding are reduced with increasing amplitude or frequency, leading to a decrease in tangential and normal forces. Increasing the amplitude or frequency can significantly increase the material-removal volume, reduce the roughness of the grinding surface, and reduce the lattice damage in the subsurface. As the amplitude increases, the grinding force decreases linearly, the removal volume increases linearly, the dislocation distribution range decreases, and the material-removal behavior gradually changes from plastic-dominated to composite removal. When the vibration frequency reaches 1 GHz, the ultra-high-frequency vibration enhances the impact effect of the diamond abrasive on the AlN workpieces and causes the atoms to acquire high instantaneous energy, thus generating high-temperature zones at the abrasive-workpiece contact area. Owing to the more intense thermal activity of the atoms, the Al and N atoms linked via covalent bonds in these high-temperature zones can be broken more easily. Hence, material removal is facilitated, the grinding force decreases, and the removal volume increases sharply. The surface of the groove is smooth, almost reaching the atomic level of flatness, and the two sides of the groove show obvious atomic-laminar removal features. At this point, the subsurface obtains a state of almost no damage; that is, no dislocations or amorphous structures are formed except for slight stacking faults in the subsurface. In contrast, when the vibration frequencies are 10 and 100 MHz, the surface roughness is high, and many dislocations and stacking layers appear in the AlN workpiece. The analysis results suggest that ultrahigh-frequency vibration induces a localized temperature increase in the abrasive-workpiece contact area and enhances the impact of the abrasive. The research results can provide a theoretical reference for optimizing the process conditions for high-efficiency and low-damage ultraprecision grinding of hard-brittle semiconductor materials.

Ultrahigh-temperature boride-silicon carbide-based ceramics are highly promising thermal-protection materials for the thermal components of high-speed aircraft owing to their high melting point, excellent thermal conductivity, and superior ablation resistance. This review systematically summarizes recent studies pertaining to the oxidation and ablation resistance of ultrahigh-temperature boride-silicon carbide coating materials. It focuses on the enhancement mechanisms achieved by incorporating various modification phases, including refractory metal silicides, rare-earth oxides, and other additives, such as borides, carbides, oxides, and metallic / non-metallic elements. The incorporation of SiC as a second phase significantly enhances the oxidation and ablation resistance of ZrB₂ and HfB₂ ceramics. The formation of a SiO₂-rich glassy phase effectively prevents oxygen diffusion. However, in high-temperature environments exceeding 1 800  ℃, SiC undergoes active oxidation. This results in the formation of a porous SiC depletion layer, which severely degrades the oxidation and ablation resistance of the ultrahigh-temperature boride-silicon carbide coating material. To suppress this phenomenon, researchers have introduced various modification phases to improve the oxidation and ablation resistance by regulating the structure of the oxide scale, increasing the viscosity of the glass phase, and inhibiting oxygen diffusion. Refractory metal silicides (e.g., MoSi₂, WSi₂, TaSi₂, ZrSi₂, and HfSi₂) enhance the oxidation and ablation resistance by providing an additional Si source, thereby resulting in complex glass phases and promoting densification. MoSi₂ and WSi₂ form volatile MoO₃ and WO₃ during oxidation, thus reducing the surface temperature; however, their excessive addition increases porosity. The modifying effect of TaSi₂ exhibits significant temperature dependence. At an intermediate temperature (approximately 1 600 ℃), TaSi₂ effectively inhibits the formation of a SiC depletion layer. The oxidation product Ta₂O₅ dissolves in the glass phase or reacts with ZrO₂ / HfO₂, thus resulting in a denser oxide scale. At ultrahigh temperatures (>1 900 ℃), Ta-containing oxidation products have relatively low melting points and tend to form low-melting eutectic phases, thus reducing the stability of the oxide scale. ZrSi₂ and HfSi₂ enhance the stability of the oxide scale by forming (Zr,Hf)O₂ solid solutions, which inhibit oxygen diffusion. Rare-earth compounds (e.g., La₂O₃, Y₂O₃, Sm₂O₃, and Yb₂O₃) improve the oxidation and ablation resistance of coatings by refining grains, stabilizing ZrO₂ / HfO₂ structures, increasing the viscosity of the glass phase, and enhancing material emissivity. Rare-earth cations dissolve in the ZrO₂ / HfO₂ lattice, thus suppressing volume changes during phase transition. Additionally, La₂O₃ and LaB₆ facilitate the formation of a stable La-Si-O glass layer. Y₂O₃ can react with SiO₂ to form silicate nanocrystals, such as Y₂Si₂O₇ or Y₂SiO₅, which disperse in the glass phase and increase the viscosity. Sm₂O₃ significantly enhances the emissivity of the coatings, strengthens thermal radiation, and reduces the surface temperature. Yb₂O₃ effectively increases the viscosity of the glass phase owing to its small ionic radius and high field strength. However, excessive addition of rare-earth elements may weaken the glass-phase structure and increase the oxygen-vacancy concentration, thus weakening the oxidation and ablation resistance of the coatings. Other modification phases, such as borides (TaB and WB), carbides (ZrC, WC, and TaC), oxides (MgO and Al₂O₃), and metallic / non-metallic elements (W, Si, and C), can enhance oxidation and ablation resistance through different mechanisms. ZrC can occupy the pores by forming ZrO₂, which inhibits the formation of the SiC depletion layer. The oxidation of WC forms WO₃, which promotes the liquid-phase sintering of ZrO₂. Graphene modification significantly improves the thermal conductivity and reduces the surface temperature of the coatings. The introduction of elemental Si directly increases the Si content and suppresses the active oxidation of SiC. Currently, the thermal-protection performance of ultrahigh-temperature boride-silicon carbide coating materials is limited to 2 300 ℃. Future studies should focus on the following aspects: first, the dynamic evolution mechanisms and quantitative evaluation methods for oxide scales should be investigated comprehensively. Second, data-driven approaches can be used to screen for modification phases and predict material performance. Finally, new active-passive synergistic thermal-protection mechanisms must be identified.

Cluster is an intermediate state between atoms and molecules and condensed matter, and its is a model matter state for studying the physical and chemical properties of nanoscale materials. Cluster ion beam is charged state clusters and it can be accelerated, transmitted or deflected under an electric field or magnetic field, forming ion beams of several eV to a few MeV. This paper reviews the basic concept, generating method and main application of the cluster ion beams. Large size gas clusters and boroncontaining clusters have been produced by supersonic adiabatic expansion from high pressures, followed by electron impact ionization to form cluster ions. Boron cluster beams have been used for fabrication of ultrashallow junctions with junction depths of 1020 nm. Large clusters containing thousands of atoms are used for surface smoothing of semiconductors, resulting in smooth surfaces with rootmeansquare roughness down to 0.7 nm. Cesium sputtering ion sources are used to produce negative small cluster containing several to tens of atoms, including B, C, F, Si and their molecular clusters (SiB, GeB). Among them, boroncontaining molecular cluster ion beams have been applied to transient enhanced diffusion doping of semiconductors, which also leads to ultrashallow implantation down to nanoscale when combined with ion beam amorphization of the surface layer. Most carbon clusters are recently used for preparation of ultrathin material such as monolayer and bilayer graphene, and it is found that nonlinear irradiation damage induced by the cluster ion beam has an evident influence on the formation of graphene. The results indicate that the cluster ion beam technology has a broad application prospect in fabrication ultralarge integrated circuit devices and synthesis of novel ultrathin nanomaterials.

Laser cladding technology is widely used in the field of surface protection and remanufacturing because of its advantages, such as metallurgical bonding between the cladding layer and substrate, high processing efficiency, low dilution rate, and high energy input. It improves the wear resistance and corrosion resistance of the substrate, as well as the life of the cladding layer of the parts. However, instantaneous melting and rapid solidification of the melt pool during the laser cladding process lead to uneven stress within the cladding layer. It has been shown that even if the basic parameters are the same, the scanning paths and scanning time intervals of different lasers significantly influence the temperature distribution, and an uneven temperature distribution further leads to an uneven distribution of thermal stresses, which can cause coating quality issues. To analyze the effect of the scanning paths on the residual stress and tribological properties of the multi-pass laser cladding layer, a multi-pass laser cladding layer of Inconel 718 was prepared on 316L stainless steel using different scanning paths, and the distribution of residual stress in the cladding layer was investigated based on the thermoelastic-plastic model and the residual stress analyzer. The microstructure and hardness distribution of the cladding layer were studied using an X-ray diffractometer, a metallurgical microscope, and a hardness testing system. The tribological properties of the cladding were evaluated using a comprehensive material surface property tester and a laser confocal microscope. The results show that, owing to the difference in temperature cycling during the cladding process, the reciprocating scanning path has the shortest interval between each cladding pass and the lowest surface residual stress. The isotropic and dispersive scanning paths exhibit intermediate surface residual stress levels, while the shrinkage scanning path, which has the largest accumulation of heat in the central region of the cladding layer, exhibits the highest surface residual stress. The isotropic scanning path results in the most homogeneous microstructure due to the differences in temperature cycling during the process. In terms of microstructure, the isotropic scanning path exhibits the most uniform microstructure. Due to the consistent time intervals between each fusion cladding pass, the cooling process remains stable, resulting in minimal changes in crystal size from the cladding layer to the fusion zone. The shrinkage path has the largest accumulation of heat in the fusion cladding layer, and the low cooling rate allowed the crystals more time to grow, which resulted in significant changes in the size of the crystals at the bottom. Owing to the differences between the primary arm spacing and the volume fraction of the Laves phase in the fused cladding, the isotropic scanning path has a uniform distribution with a low content of the Laves phase and the lowest abrasion rate of the fused cladding layer. The reciprocating and dispersive scanning paths have intermediate abrasion rates, while the shrinkage-type scanning path has the highest abrasion rate due to its larger number of Laves phases. Therefore, a reciprocating scanning path should be selected for multi-pass cladding to reduce residual stresses in the cladding layer, and an isotropic scanning path should be selected to reduce the wear rate of the cladding layer. The results of the different scanning paths are expected to provide a theoretical basis for the selection of process parameters in the fields of surface protection and remanufacturing.

Chemical mechanical polishing (CMP) is a pivotal process in advanced semiconductor manufacturing that enables wafer surface planarization. CMP endpoint detection (EPD) technology achieves precise control over the wafer surface topography and material removal rates by dynamically adjusting the polishing pressure in different zones through real-time measurements of the thin film thickness. However, current EPD techniques face challenges in accurately capturing material removal rate variations in localized regions of wafers with complex patterns and nonuniform density distributions, leading to discrepancies between the detection signals and actual polishing states. Moreover, polishing processes involving multi-material systems suffer from limited signal resolution and selectivity, making it difficult to precisely detect interface changes. Thus, the investigation and optimization of CMP EPD technologies are crucial for addressing the challenges posed by multi-material and novel structures and improving the precision and stability of the process. This paper systematically reviews the current research on CMP EPD technologies, focusing on the principles, characteristics, and advancements in offline (e.g., the time method) and online (e.g., friction-based, optical, and eddy-current techniques) detection methods. In the early or stable stages of the CMP processes, endpoint control relies predominantly on experience and time-based polishing and lacks precise online detection. With technological advancements, four-probe offline detection instruments have been employed for post-polishing evaluations. However, these methods require extensive data accumulation and an understanding of the process parameters to determine the optimal polishing time for each material and process. Advanced CMP processes involve diverse materials, such as shallow trench isolation, interlayer dielectrics (SiO₂), metal interconnects (Cu), and barrier layers (Ti / TiN), each with distinct polishing rates and removal mechanisms. Offline detection methods struggle to adapt to these variations in real-time. In addition, time-based offline detection fails to account for wafer-to-wafer differences, rendering it insufficient to meet the demands of advanced CMP processes for real-time monitoring and rapid response. Consequently, online detection methods are often required to ensure process stability and product quality. Online EPD technologies enable real-time monitoring and analysis of polishing conditions during the CMP process, ensuring the achievement of the desired endpoints. These technologies are pivotal for automating the polishing process and enhancing the integrated circuit yield. Friction-based online EPD techniques offer strong real-time performance and ease of integration, making them particularly suitable for capturing dynamic mechanical interactions during polishing. However, these methods are significantly influenced by process conditions, such as pad wear and slurry flow, with signal noise and external disturbances undermining the detection accuracy and reliability. Future advancements in friction-based EPD should include the introduction of adaptive calibration mechanisms to mitigate external disturbances and the development of high-sensitivity friction sensors to explore the nanoscale film removal characteristics and meet the requirements of advanced process nodes. Optical EPD techniques typically achieve sub-nanometer resolutions for film thickness measurements. However, optical methods are highly sensitive to environmental conditions, with polishing slurry, debris, and surface contamination potentially interfering with signals and reducing detection precision. Future improvements in optical EPD systems should focus on enhancing the optical system design to resist interference from slurry, contaminants, and environmental fluctuations. Eddy-current EPD provides nanometer-level thickness measurements at a relatively low cost and can be easily integrated with CMP equipment. However, its insensitivity to insulating materials, such as dielectric layers, limits its ability to independently detect dielectric and nonmetallic films. Furthermore, the development of eddy-current sensors capable of achieving high-precision (nano- / sub-nanometer scale) measurements under large lift-off variations remains critical for future research. In the future, multi-physics field fusion methods will play a pivotal role in enhancing the detection performance to address the challenges posed by multilayer film stacks and heterogeneous material systems in 3D devices for advanced process nodes. By integrating optical, eddy-current, and friction-based techniques with multi-sensor collaborative acquisition and data fusion algorithms, the selectivity and accuracy of EPD can be significantly improved. Furthermore, AI-driven intelligent signal processing equipped with robust feature learning, pattern recognition, and intelligent decision-making capabilities enables the analysis and prediction of complex three-dimensional structural signals while adaptively adjusting the parameters, thereby enhancing the adaptability of EPD technologies. Additionally, flexible and customizable sensor designs combined with micro-area detection techniques contribute to increased spatiotemporal resolution, facilitating the precise monitoring and dynamic regulation of localized polishing conditions.

采用低压等离子喷涂技术在镍基单晶高温合金上制备了NiCoCrAlYTa涂层,研究了不同功率参数制备的涂层在900℃175 h氧化后的特性,探讨了该涂层的氧化和退化机理.结果表明,3种功率制备的涂层都达到完全抗氧化级水平,其平均氧化速率分别为0.01 g/m2·h、0.01g/m2·h和0.0026g/m2·h,但不同涂层的氧化行为有所不同.3种试样氧化后表面形成了大量的β-Al2O3,并在涂层表面发生选择性氧化.X衍射分析表明,涂层发生了退化.

Thermal barrier coatings (TBCs) are a core technology for protecting hot-end components in the aerospace, aviation, and energy sectors and play a critical role in ensuring the safe and stable operation of these high-temperature systems. Since the concept of TBCs was proposed by NASA in the 1950s, this vital technology has gone through nearly 80 years of continuous development and evolution. During this period, several researchers worldwide devoted tremendous time, energy, and expertise to advancing its material systems, preparation processes, and overall performance, laying a solid foundation for its widespread application in key industries. With the rapid development of high-entropy alloys (HEAs) and high-entropy ceramics (HECs) in recent years, high-entropy materials engineering has emerged as a crucial and promising development direction for TBC material systems. This shift toward high entropy has created new avenues for overcoming the performance limitations of traditional TBC materials. However, systematic reviews that comprehensively discuss the structural evolution of coatings, their damage mechanisms, and innovation directions in the context of high-entropy engineering remain relatively scarce. This limitation makes providing effective theoretical and technical support for collaboration between research and practical applications in the TBC field difficult, hindering the translation of lab-based achievements into industrial practice. To address this gap, this paper systematically sorts out the changes in TBC demand driven by the continuous advancements in industrial production (such as energy equipment upgrades) and aerospace transportation (including aircraft and spacecraft development) from the perspective of the need for heat management and control. It shows that the operating conditions of hot-end components (such as gas turbine blades and aero-engine parts) are gradually breaking through the 1200 ℃ temperature resistance limit of traditional TBCs, making it urgent to research and develop new types of ultra-high-temperature TBCs that can withstand more extreme thermal environments. Subsequently, this paper explains the core service mechanism of these advanced TBCs, which achieve synergy through two key approaches: reducing the thermal conductivity through phonon scattering and improving the thermal emissivity. It also analyzes the key damage mechanisms that threaten TBC longevity, including the growth of thermally grown oxide (TGO) at the coating interface, coupled corrosion caused by multiple factors, erosion-induced spallation, and sintering densification. This elaborates the innovation directions of high-entropy TBCs: the focus is moving toward multi-layered, gradient, and complex designs of the coating surface; the bond coat alloy is becoming more diversified and highly entropic through doping and dissolving refractory elements (such as W, Mo, and Ta) into its structure (to enhance high-temperature stability); and the top ceramic layer is undergoing structural diversification and high-entropy engineering based on classic structures such as fluorite, pyrochlore, and perovskite (to balance thermal insulation and corrosion resistance). Additionally, this review examines the application prospects of multi-principal component coating design driven by computational materials science, represented by machine learning, first-principles calculations, and phase diagram calculations, as well as the use of refractory high-entropy coatings under extreme operating conditions (such as hypersonic flight and nuclear energy systems). Finally, this paper proposes that developing new coating preparation technologies and combining them with existing mature ones while focusing on the efficient and low-cost preparation of high-entropy TBCs is the key path to the wide application of high-entropy coatings in hot-end component protection. This paper is expected to provide clear guidance for the development of high-performance coatings and contribute to the collaborative advancement of coating research and applications under harsh working conditions.

Diamond-like carbon (DLC) films are renowned for their exceptional wear resistance, low friction factor, and high hardness, which have led to their widespread application in the automotive, aerospace, and mechanical manufacturing industries. Various advanced techniques have been developed to control the properties of DLC films and prolong the service lives of mechanical components under wear and corrosion conditions, thereby enhancing their performance. The body of research in this field is continuously being enriched and refined. However, there is a scarcity of comprehensive review papers, which are crucial for guiding the development of the entire industry and academic domain. In response to this need, this study systematically summarizes the existing research on the wear-resistant properties of DLC films from both domestic and international perspectives, focusing on aspects such as preparation technology, process parameter optimization, modification through element doping, gradient construction, and surface texturing. A comprehensive aggregation of the research results strongly suggests that the meticulous adjustment of the process parameters is indispensable for marked enhancements in the hardness and wear resistance of DLC coatings. Element doping can improve the structure and properties of DLC films to achieve high elastic recovery as well as low friction and wear; gradient construction can strengthen the adhesion, hardness, and wear resistance of DLC films; and surface texturing can enhance the tribological performance of DLC films. Therefore, by finely controlling the process parameters, types and contents of doping elements, and design of surface structures, the microstructures of DLC films can be effectively altered to achieve an increase in the wear resistance, a reduction in the friction coefficient and wear rate, and enhanced adhesion, hardness, and wear resistance. These improvements are beneficial for extending the service lives of mechanical components under severe operating conditions. By comprehensively adjusting the manufacturing processes and other strategies for DLC films, this study achieves an overall upgrade in wear-resistant performance, thus filling the void in the industry for a systematic review on the optimization of DLC film properties. The research summarized in this study covers a range of deposition techniques, including physical vapor deposition (PVD), chemical vapor deposition (CVD), and plasma-enhanced chemical vapor deposition (PECVD), which are vital for achieving the desired film properties. The optimization of process parameters, such as the substrate temperature, deposition pressure, ion energy, and gas flow rates, is discussed, as all these parameters are critical for controlling the structure and performance of the film. The role of element doping in modifying the properties of films is investigated, with a focus on the use of transition metals, rare earth elements, and other alloying agents to enhance certain characteristics of DLC films. Furthermore, the study explores the concept of gradient construction, where the compositions and structures of films are varied throughout their thicknesses to create a gradient that can improve adhesion to the substrate and enhance mechanical properties. The study also addresses surface texturing, which involves the creation of micropatterns on the surface of a film to reduce friction and wear, which is a feature of particular importance for applications in which tribological performance is critical. In conclusion, this study provides a thorough overview of the research and development in DLC film technology by highlighting the key areas that are essential for the advancement of the field. This study underscores the importance of a holistic approach to the design and fabrication of DLC films and emphasizes the interplay among preparation techniques, process optimization, material modification, and surface engineering to achieve superior wear-resistant performance. This comprehensive review is significant in guiding future research and fostering innovation in the application of DLC films across various industries, and it serves as an essential reference for the further development of related technical fields.

喷雾造粒制备莫来石粉末,采用大气等离子设备对造粒粉末进行等离子球化和涂层制备。利用激光粒度分布仪对粉末粒度分布进行测试;扫描电镜和X射线衍射仪分别表征了粉末和涂层的相组成和微观形貌。结果表明:喷雾造粒和等离子球化后的莫来石粉末粒径为正态分布;造粒的莫来石粉末主要由晶态莫来石和SiO2相组成;等离子球化后,粉末中出现玻璃态非晶相;等离子球化过程中,较小粒径粉末表面基本上完全熔融,较大粒径粉末的表面为部分熔融;同时,制备的莫来石涂层具有良好的微观形貌和较高的显微硬度;涂层经热处理后,非晶相转变为晶态莫来石,并且有部分石英相析出。

Single-crystal silicon carbide (SiC), as a wide-bandgap semiconductor material with excellent properties, is widely used in high-power electronic devices and optoelectronic fields. However, its high brittleness, extreme hardness, and strong chemical inertness pose significant challenges for achieving efficient and low-damage polishing. Chemical mechanical polishing (CMP) cannot meet industrial efficiency requirements owing to its slow reaction kinetics. Therefore, this study introduces ultrasonic vibration into the photocatalytic chemical mechanical polishing (PCMP) method to investigate the synergistic enhancement mechanism of ultrasonic-assisted photocatalysis and the material removal mechanism under multi-energy field interactions, with the aim of advancing the development of multi-energy field collaborative polishing technology. Three different experiments were designed to evaluate the effects of ultrasonic frequencies (0, 22, 25, 28, and 40 kHz) on the chemical and mechanical performance. This study combined photocatalytic oxidation with ultrasonic vibration, using nano-TiO₂ as a catalyst under UV irradiation to induce cavitation effects. The Oxidation performance characterization tests utilized a methyl orange solution as an indicator, with the decolorization time of the polishing solution under ultrasonic-assisted photocatalytic conditions used to assess oxidative strength being shorter, indicating a stronger oxidation capability. The static corrosion tests involved immersing the SiC samples in the polishing solution for 2 h under ultrasonic-assisted photocatalytic conditions. The resulting oxide layers were quantified using scanning electron microscopy and X-ray photoelectron spectroscopy. Ultrasonic-assisted PCMP experiments were conducted using SiO₂ abrasive slurry for 2 h, with the material removal rates and surface roughness measured to evaluate polishing performance. At 22 kHz ultrasonic vibration, the methyl orange decolorization time was 229 s, the oxygen content on the corroded surface reached 2.94at.%, the material removal rate was 503.47 nm / h, and the surface roughness was 48.28 nm. Compared with photocatalytic oxidation alone, ultrasonic assistance reduced the decolorization time by 117.90%, increased the oxygen content by 215.96%, improved the material removal rate by 52.63%, and reduced the surface roughness by 91.30%. The electron-hole pairs generated by the photocatalyst under illumination effectively promoted the formation of highly oxidative radicals (e.g.,·OH) in the reaction environment, accelerating the formation of oxide layers. The·OH in the polishing solution oxidized the surface, forming oxide layers primarily composed of Si and C oxides, which exhibited significantly lower hardness, strength, and bonding strength compared with the original SiC surface, thereby allowing easy removal using diamond or silica abrasives. Ultrasonic vibration enhanced both the chemical oxidation and mechanical removal stages of the polishing process. During ultrasonic propagation in liquids, cavitation bubbles formed and collapsed rapidly upon reaching a critical size during the compression cycles, generating localized high-energy microenvironments with temperatures exceeding 5 000 K and pressures up to 1 000 atm. Ultrasonic effects accelerated the mass transfer among the reactants, catalysts, and radicals, reduced the diffusion resistance, rapidly removed intermediate products generated during photocatalytic reactions, prevented reaction blockage, promoted electron-hole pair separation, reduced recombination rates, increased·OH concentration, and significantly improved the photocatalytic oxidation efficiency. The collapse of the cavitation bubbles enhanced the kinetic energy of the catalysts and abrasives, increasing the contact frequency and efficiency between the workpiece, catalysts, and abrasives, thereby improving the oxidation rate and mechanical removal efficiency of SiC. Ultrasonic vibrations also promoted the uniform distribution of photocatalysts and abrasives, eliminated catalyst agglomeration, increased the reactive surface area, enhanced the photocatalytic efficiency, and improved the surface uniformity and consistency. In addition, the localized high-temperature environments generated by cavitation bubbles further enhanced the chemical reactions. Notably, lower ultrasonic frequencies exhibited stronger cavitation effects, significantly improving the efficiency of ultrasonic-assisted PCMP. Owing to the synergistic effects of ultrasonic vibration, photocatalysis, and mechanical forces, the wear characteristics of the surface were significantly different from those after traditional grinding and polishing. Ultrasonic action improves the fracture toughness, facilitates plastic removal, and reduces subsurface damage. Therefore, integrating ultrasonic vibration into PCMP enhances the photocatalytic activity and abrasive kinetic energy, increases the oxidation rates and removal efficiency, and enables more efficient polishing of single-crystal SiC.

In the production process of a hundred-meter-long high-speed railway track, the rolling mill serves as a key component, bearing the effects of alternating high-temperature rolling parts and cooling water. It also faces significant extrusion, shear, and thermal stresses on the surface, resulting in problems such as short service life and severe roller surface wear due to failure. As a primary consumable component in the production processes of many industries, the scrapping a large number of rolls results in considerable waste of energy and resources in China. To repair the surface of scrapped rolls and improve their thermal fatigue performance, we developed the powder composition of iron-based powder, leveraging the good compatibility between the iron-based powder and the matrix material and the reduced cracking during the melting process. Considering the actual production conditions of the rolling mill, selecting an appropriate strengthening element is necessary to improve the performance of the repaired surface. Mo exhibits a good solid-solution strengthening effect and forms carbides, thereby enhancing the strength and wear resistance of the substrate. To further improve the wear resistance of the cladding layer while ensuring good thermal fatigue performance, elemental V was added to improve high-temperature stability, allowing the cladding layer material to maintain good performance at elevated temperatures. A laser cladding technique was used to prepare an iron-based coating using T504 as the base powder, with Mo and V added to the surface of a fatigue- failed 160CrNiMo roller material. The crack propagation rate and mechanism in the base material and cladding layer during thermal fatigue were analyzed using optical microscopy, scanning electron microscopy, and thermal fatigue testing machines. The results show that the average hardness of the cladding layer with Mo and V ratios of 1:0.5, 1:1, and 1:1.5 is 59.2 HRC, 59.9 HRC, and 59.1 HRC, respectively, representing an average increase of 33.4% compared to the substrate; The driving force for crack propagation during thermal fatigue tests primarily arises from the thermal stress generated by cold and hot cycles. After 2000 thermal fatigue testing cycles, the crack length in the matrix material sample measured 11.289 mm. Due to its high carbon equivalent, the brittle phase of eutectic M₇C₃, which contains a higher Cr content than the surrounding material, exhibited a different coefficient of thermal expansion. This mismatch became the main channel for crack propagation during the thermal fatigue testing process, where cracks primarily propagated in a transgranular form. The crack lengths of the samples with added Mo and V mass ratios of 1:0.5, 1:1, and 1:1.5 in the cladding layer were 3.185 mm, 16.596 mm, and 8.401 mm, respectively. The high hardness of the cladding layer, resulting from the addition of Mo and V, increased its brittleness. As the V content increased, the eutectic structure of the cladding layer gradually appeared to break down; the initial boundary became clear and blurred, compromising the integrity of the structure and leading to an increase in the number and length of microcracks. During thermal fatigue testing, the propagation of fatigue cracks was predominantly brittle and transgranular, exhibiting a rapid propagation rate. The sample completed the rapid crack propagation stage after 50-100 cycles. However, appropriate addition of V can improve high-temperature stability and result in shorter cracks. When the mass ratio of Mo to V was 1:0.5, the thermal fatigue performance of the roller material before repair improved by 71.7%. A comparison of the thermal fatigue characteristics of the iron-based coatings with different Mo and V mass ratios provides an experimental basis for selecting iron-based coating systems for roller repair.

Nanoprecision surface manufacturing technology has important applications in many high-tech fields, such as semiconductor photovoltaic and integrated circuit manufacturing. Chemical mechanical polishing (CMP), the most critical technology in ultraprecision surface manufacturing, guarantees and promotes the application and development of high-end technologies. Gallium arsenide (GaAs) is the most important second-generation semiconductor substrate, and it is widely used in microelectronics and optoelectronics. High-quality GaAs substrates require the absence of surface / subsurface damage, preservation of lattice integrity, and sub-nanometer level surface roughness. CMP is currently the most effective technology to achieve these requirements. As material removal in CMP is predominantly governed by tribochemical reactions, understanding these mechanisms is essential for enhancing the surface quality. In this study, the tribochemical removal mechanisms during CMP of GaAs were investigated by conducting nano-wear experiments using an atomic force microscope (AFM) equipped with a silicon dioxide (SiO₂) microsphere tip under acidic (pH ≈ 4), neutral (pH ≈ 7), and alkaline (pH ≈ 10) conditions. Material-removal regions were characterized using high-resolution transmission electron microscopy (TEM). Density functional theory (DFT) calculations were employed to elucidate the atomic removal mechanisms. The results indicate that material removal on the GaAs surface is the most severe in alkaline conditions, with removal depths and volumes being significantly higher compared with those in neutral and acidic conditions. Specifically, the material removal depths in the acidic, neutral, and alkaline conditions were approximately 9.4, 19.2, and 24.2 nm, respectively. Similarly, the material removal volume increased from 4.99×10⁶ nm³ in acidic conditions to 8.84×10⁶ nm³ in alkaline conditions. A TEM analysis revealed that the lattice structure in the material-removal regions remained intact, suggesting that tribochemical reactions dominated the removal process without causing significant damage to the underlying atomic structure. The significant change in the charge density at the GaAs / SiO₂ interface, as calculated by DFT, suggests the formation of Si-O-Ga bonds. Furthermore, interfacial charge transfer was the most pronounced in alkaline conditions, where OH^- ions promoted the formation of Si-O-Ga bond bridges and weakened Ga-As bonds, facilitating material removal. The calculations showed that the charge transfers in the subsurface region of GaAs were 0.032, 0.039, and 0.042 e / ų under acidic, neutral, and alkaline conditions, respectively. This increased charge transfer in alkaline conditions leads to a more significant weakening of the Ga-As bonds, making the material more susceptible to removal. Additionally, CMP experiments conducted under the same pH conditions confirmed that the surface roughness and material removal rate (MRR) were optimal in alkaline conditions. The surface roughness (Sa) values were approximately 3.61, 1.87, and 0.81 nm for acidic, neutral, and alkaline conditions, respectively. The MRR values followed a similar trend, with the highest rate observed in alkaline solutions (22.6 nm / min), compared with those in neutral (19.4 nm / min) and acidic (13.2 nm / min) conditions. This consistency between the nanowear experiments and CMP results underscores the importance of pH in controlling the tribochemical removal process. These findings suggest that the presence of OH^- ions in alkaline conditions enhances the formation of Si-O-Ga bonds and increases charge transfer at the GaAs / SiO₂ interface, leading to more efficient material removal. This study provides valuable insights into the pH-dependent tribochemical removal mechanisms during the CMP of GaAs, providing a foundation for optimizing CMP processes for other binary materials. The integration of single-abrasive material removal experiments based on AFM, TEM, and DFT calculations presents a comprehensive approach for understanding and improving CMP techniques for semiconductor materials. By elucidating the role of pH in the tribochemical removal process, this study contributes to the development of more efficient and precise CMP methods that ultimately enhance the performance of semiconductor devices.

Micro-arc oxidation (MAO) is a surface treatment method widely used for fabricating ceramic coatings on light metal substrates. MAO significantly enhances the properties of these metals, including their corrosion resistance, wear resistance, and thermal control capabilities. This paper provides a comprehensive review of recent developments in MAO technology, focusing on the design and application of functional ceramic coatings.
The growth mechanism of MAO coatings involves several key stages: linear voltage increase, local discharge, voltage stabilization, and coating stabilization. In these stages, a ceramic coating with numerous micropores and microcracks is formed, which significantly impact the properties of the coating. By modifying the electrolyte composition, the morphology and properties of the resulting coating can be optimized to satisfy specific requirements.
One of the primary applications of MAO coatings is corrosion protection. The corrosion resistance of MAO coatings can be enhanced by adjusting the electrolyte composition to improve the density and reduce the porosity of the coating. The incorporation of micro-nanoparticles into the electrolyte can further enhance the corrosion resistance of the coating. The addition of certain compounds to the electrolyte during the MAO process can increase the density and thickness of the coating, thereby reducing its porosity and improving its protective properties. Another effective method for improving corrosion resistance is the creation of composite coatings, in which post-treatment techniques are used to seal the pores, thereby enhancing the long-term stability of the coating.
In addition to corrosion protection, MAO coatings provide improved wear resistance and lubrication. The in situ formation of the coating was achieved by adding micro- and nanoparticles to the electrolyte during the MAO process. These particles influence the formation of the coating and contribute to its self-lubricating, high-density, and hard surface properties. Furthermore, post-treatment methods, such as filling the coating pores with lubricating agents or combining the coating with polymer composites, can enhance the wear resistance and lubricating properties of the coating. These post-treatment techniques exploit the porous structure of MAO coatings to improve the adhesion and bonding strength of the lubricants or polymers used.
The thermal protection properties of MAO coatings can be tailored by adjusting electrolyte additives and electrical parameters. By incorporating specific soluble or insoluble additives, it is possible to regulate the optical properties of the coating, such as its solar absorptivity and infrared emissivity. This makes MAO coatings suitable for application in aerospace engineering where heat control is critical. The addition of materials such as metal oxides, which are generated during the MAO process, can further optimize the thermal performance of the coating.
For electrical insulation, high-density MAO coatings with reduced porosity provide excellent dielectric properties. By adjusting the electrical parameters and optimizing the electrolyte composition, it is possible to fabricate coatings with high electrical insulation performance. The porosity, thickness, and density of MAO coatings can be precisely controlled to meet specific requirements for insulation.
Despite these advancements in MAO technology, there are still challenges to overcome. The long-term stability of functional coatings remains a concern because the complex formation process can lead to coating surface porosity and nonuniformity, which may affect the coating performance under extreme conditions. In addition, precise controlling of microstructure and performance of MAO coating—such as porosity, thickness, and density—remains a challenge. Ensuring the comprehensive performance of composite coatings, especially those produced through MAO plus post-treatment processes, presents challenges in different environmental conditions.
In summary, this paper systematically reviews the progress in MAO technology, emphasizing various strategies for optimizing MAO coatings for different applications. The research presented here provides valuable insights into the potential of MAO coatings in a wide range of functional fields. This paper also discusses future directions for improving the performance and expanding the applications of MAO technology, providing a theoretical foundation for further research and practical applications.

Additive manufacturing technology can realize the integral molding of complex components of ceramic materials, but defects exist, including the “step effect” multiphase distribution, and porosity on the surface of the components. Moreover, subsequent precision machining struggles to meet the urgent demand for high-performance silicon-carbide ceramic components for space optical detectors and semiconductor manufacturing equipment. Therefore, this study proposes a novel approach by which to repair surface defects in ceramic additive manufacturing using the chemical vapor deposition (CVD) of high-purity, high-density silicon carbide coatings. However, the proposed method still faces problems of interfacial bonding with the additive ceramic substrate and the growth pattern of the coating. Hence, the effects of the deposition temperature on the interfacial bonding, micromorphology, surface hardness, and machinability of chemical vapor-deposited silicon carbide on additive manufacturing ceramic surfaces were systematically investigated. This study used rapid laser prototyping and the silicone infiltration composite method to manufacture silicon carbide ceramic substrates and prepare silicon carbide coatings via chemical vapor deposition. The silicon carbide coatings were deposited at different temperatures of 1 200, 1 300, 1 400, and 1 500 ℃. The coatings were then deposited on the surfaces of ceramic substrates at the same temperature. The effects of the deposition temperature on the hardness, deposition efficiency, interfacial bonding, microstructure, and processability of the SiC surface coatings were systematically investigated using various techniques such as scanning electron microscopy (SEM), X-ray diffraction (XRD), surface roughness measurements, micro-computed tomography (micro-CT), and scratch tests. The results showed that the hardness of the additively fabricated SiC ceramic was only 1 226 HV_0.5 before any coating was deposited, and the roughness after polishing was 1 980 nm. Because of the presence of multiple phases, the roughness was too high to achieve a mirror effect. At a deposition temperature of 1 200 ℃, a peak of free silicon (Si) appeared in the coating owing to the high precursor gas concentration. However, the temperature was insufficient to promote uniform surface deposition, which resulted in an apparently homogeneous deposition in which free Si atoms in the gas phase were deposited directly onto the substrate. As the deposition temperature increases, the deposition rate accelerates, and the critical nucleation radius of the new phase gradually increases. The critical nucleation free energy also increases, resulting in the formation of larger SiC grains. The Si-C bonds within these grains remained intact, contributing to the overall hardness. However, at an excessively high deposition temperature, pores begin to form between the grains, resulting in low density and high porosity of the substrate and coating. Despite these problems, the silicon carbide coatings deposited at all temperatures formed good bonds with additively fabricated ceramic substrates. Notably, as the deposition temperature reaches 1 400 ℃, the silicon in the substrate begins to evaporate, and defects and porosity appear on the substrate surface. These defects provide additional nucleation points for the coating, and the morphology of the coating at the interface becomes columnar. As the coating grows to a certain thickness, it transforms into a dense structure. The columnar crystals significantly enhance the bond strength of the coating and improve its surface workability, which reduces its roughness to 9.08 nm. After polishing, the coating exhibited a mirror-like finish at all deposition temperatures. Thus, this study demonstrates that the application of CVD SiC coatings can significantly improve the surface quality of additively manufactured ceramics. This approach provides a theoretical basis for engineering applications of high-performance ceramic components in advanced devices.

Gas nitriding-quenching (N+Q) compound treatments on GCr15 steel were carried out and compared with single processing of gas nitriding and quenching. The phases, microstructures, and the dry sliding friction properties of samples were studied. By single gas nitriding at 530℃ for 9 h, the compound layer was composed of ε phase with a thickness of about 40 μm. However, the nitride of ε phase in the compound layer were completely decomposed in N+Q compound treatment, which promoted N element to diffuse into the matrix, and the thickness of the diffusion region was about 900 μm. Compared with the single quenching hardness of GCr15 steel, the hardness of diffusion region was improved about 200 HV_0.1, because of soluble N element. However, the surface hardness dropped down, due to the porosity resulting from the decomposition of nitrides. Furthermore, under the loads of 20 N and 100 N, the dry reciprocating sliding frictions were carried out respectively. The results show that the friction co-efficients (COF) of both single gas nitriding and N+Q compound processing are lower than that of single quenching treatment. The wear resistances of N+Q compound treatment samples are improved, compared with nitriding and quenching samples at a load of 20 N, and decreases at a load of 100 N due to the surface porosity during initial steps. However, after the initial steps, the anti-wear ability of N+Q compound treatment samples increases again.

In recent years, laser cladding for the preparation of high-entropy alloys (HEAs) has attracted widespread attention in aerospace, transportation, and marine applications. FeCoCrNi-series high-entropy alloys are among the most widely studied transition-metal HEAs. Due to their unique properties (i.e., high-entropy effect, lattice distortion effect, slow diffusion effect, and cocktail effect), FeCoCrNi-series entropy alloys can achieve synergistic improvement in strength and toughness. Many studies have confirmed that laser-cladding FeCoCrNiAlTi HEA coatings offer excellent mechanical properties, including high strength, toughness, corrosion resistance, and oxidation resistance at high-temperatures. However, there are currently few studies on the friction and wear mechanism of FeCoCrNiAlTi HEA coatings under corrosion-friction coupling, and the interaction between alloy elements, microstructure, wear, and corrosion resistance remains unclear. In this study, a FeCoCrNiAl_0.5Ti_0.5 HEA coating was prepared on an AISI 1045 steel substrate using laser-cladding technology. Dry and wet friction tests were performed on the coating and substrate immersed in the solution for different durations. The dry and wet friction was tested using a ball-on-disc wear test. After grinding and polishing, the microstructure of the sample surface was characterized, followed by corrosion in an aqua regia solution (75 mL HCl and 25 mL HNO₃ per 100 mL solution) for 30 s. The hardness pits of the sample and the transition from the coating to the substrate were observed via optical microscopy (OM). After the wear test, the depths and widths of the wear scars were measured using a three-dimensional profilometer. The microstructures and wear scar characteristics of the samples were characterized using a scanning electron microscope (SEM) equipped with an energy-dispersive X-ray spectroscope (EDS) and an electron backscatter diffraction (EBSD) detector. The phase compositions of the powder and sample were characterized using X-ray diffraction (XRD). The dry and wet friction behaviors of the coating related to atmospheric and corrosive environments were investigated in combination with the friction and wear test results. The results indicated that the microstructure of the laser-cladded FeCoNiCrAl_0.5Ti_0.5 HEA coating mainly consisted of a dendrite region (DR) with a body-centered cubic (BCC) phase and an interdendritic region (IR) with a face-centered cubic (FCC) phase. In addition, under spinodal decomposition, a portion of the BCC phase in the lamellar eutectic structure of the coating transformed into the L2₁ phase. The laser-clad FeCoNiCrAl_0.5Ti_0.5 HEA coating demonstrated excellent wear resistance. The friction factor of HEA coating and the dry friction factor of AISI steel substrate were 0.69 and 0.75, respectively, with wear rates of 5.04×10^-5 mm³ / (N·m) and 1.41×10^-4 mm³ / (N·m), respectively. The immersion time in a 3.5wt.% NaCl solution significantly influenced the wet friction and wear properties of the laser-cladded FeCoNiCrAl_0.5Ti_0.5 HEA coating. The wet friction wear rate of the coating increased with the immersion time. The wet friction wear rate of the unimmersed coating was 1.11×10^-5 mm³ / (N·m), while that of the coating immersed for 15 days increased by 1.77 times, reaching 3.08×10^-5 mm³ / (N·m). The main forms of dry friction and wear of the laser-clad FeCoNiCrAl_0.5Ti_0.5 HEA coating were three-body wear and abrasive wear, whereas the wet friction wear process was affected by corrosion, oxidation wear, and three-body wear. The wet friction wear process is lubricated by water and oxide films between the friction pairs; therefore, the wear rate is significantly lower than that in dry friction. However, under wet friction conditions, the oxide film was easily corroded, leading to the formation of microcracks and film delamination, ultimately resulting in three-body wear.

采用离子镀技术在NdFeB基体上沉积ZrN、ZrN/Zr多层和TiN/Ti多层涂层,考察了其耐腐蚀性能,分析了腐蚀过程.采用静态全浸腐蚀试验(20 % NaCl, 20 ℃)测定其失重曲线,扫描电子显微镜(SEM)分析腐蚀前、后的涂层表面形貌变化及腐蚀过程,用CHI600B系列电化学分析仪测试极化电位.试验发现:未镀层NdFeB基体在4 h后明显失重,随时间延长失重速率增加.施加涂层基体10 h后失重,随时间失重速率增加,但小于未镀层试样.NdFeB基体的自腐蚀电位约﹣1.037 V,腐蚀电流1.69×10-3 A/cm2;施加涂层后自腐蚀电位向正向移动0.131V(TiN/Ti)～0.258 V(ZrN),腐蚀电流10-5～10-6 A/cm2;ZrN/Zr涂层由7层增加到14层后,腐蚀电位提高0.037 V,腐蚀电流降低.结果说明:离子镀沉积ZrN系列涂层显著提高NdFeB耐腐蚀性能.增加ZrN/Zr周期能够提高耐蚀性能.腐蚀源首先在涂层表面缺陷与基体结合部位形成.一旦形成腐蚀源,NaCl晶体即在基体上结晶并生长,随着此过程进行,涂层逐步腐蚀.

Continuous-fiber-reinforced resin-based composite materials represent a novel class of high-performance composites that have gained traction in recent years. The use of additive manufacturing technology for fabricating these composite materials offers significant advantages, including enhanced manufacturing flexibility and high forming efficiency, thereby making it a key research focus. Herein, the characteristics of both resin matrix and fiber materials are summarized, followed by an examination of the extrusion and impregnation processes involved in the additive manufacturing of continuous fiber-reinforced resin-based composites. Furthermore, the impact of process parameters such as temperature, printing speed, and printing spacing on the material are discussed. Additionally, the microstructure at the fiber-matrix interface and between layers are discussed, in addition to the mechanical properties of the material, including tensile and bending strengths. Finally, the challenges associated with increasing demand and performance limitations in the additive manufacturing of these composites are highlighted, proposing recommendations for their development, such as enhancing material recyclability and optimizing the additive manufacturing process. Both thermoplastic and thermosetting resins typically serve as matrix materials. Thermoplastic materials, exhibiting relatively low melting temperatures, facilitate processing in additive manufacturing. However, the high viscosity of these materials contributes to the low impregnation between fibers and resin, resulting in relatively lower mechanical properties than those of continuous fiber-reinforced composite materials produced via conventional methods. Conversely, thermosetting materials exhibit low viscosity, thereby enhancing fiber impregnation. However, they present challenges in the formation of composite materials, thereby increasing production costs. Additionally, additive manufacturing of thermosetting composite materials generates waste, contributing to material loss. Therefore, investigating the recyclability of these materials remains a crucial area for future research. The additive manufacturing process for continuous fiber-reinforced composite materials is influenced by factors such as fiber impregnation, material extrusion, fiber volume fraction, fiber orientation, and processing temperature, all of which influence material formation. However, significant challenges persist in additive manufacturing, and further improvements in the manufacturing process are essential. Research indicates that compared with composite materials produced via conventional processes, those fabricated via additive manufacturing exhibit lower mechanical properties. The primary factors influencing the mechanical properties of the final material include the bonding between the fiber-matrix interfaces as well as between layers. Inadequate bonding between the materials results in pore formation, causing stress concentration within the material and reducing its mechanical properties, thereby accelerating material failure. To further enhance the performance of fiber-reinforced composite materials and address existing limitations, future research must prioritize the following aspects. First, different matrix materials exhibit distinct effects on the performance of composite materials. Selecting an appropriate matrix material is crucial, necessitating further research into novel resin matrix materials. Additionally, as the use of composite materials increases, their recyclability has become as a critical constraint for industrial applications. Therefore, future research on material recyclability must be prioritized. Second, in the context of additive manufacturing of composite materials, in addition to the inherent properties of the materials, multiple avenues for process improvement exist. The impregnation process can be optimized via auxiliary techniques, such as plasma and oxidation treatments. Furthermore, controlling process parameters such as printing speed, temperature, and environmental conditions is essential for ensuring consistent material properties. Further investigation into the influence of these parameters on the material properties is necessary. Third, defects such as low interface performance and porosity in composite materials are typically attributed to insufficient compaction during the manufacturing process. Improving the compaction process or performing post-processing on the material can significantly enhance the performance of additive manufacturing.