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Supervised by:
China Association for Science and Technology
Sponsored by:
Chinese Mechanical Engineering Society
Director of Editorial Office:
XUE Qunji
Chief Editor:
SHAO Tianmin
Started in 1988, Bimonthly
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23 October 2025, Volume 38 Issue 5
Development and Challenges of Surface Planarization Technology for Single Crystalline Diamond
YANG Kuo, CHAI Zhimin, DAI Yuanjing, LIU Yuhong, LU Xinchun
2025, 38(5): 1-33.
https://doi.org/10.11933/j.issn.1007-9289.20250415001
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Research Progress in Abrasive Technology for the Chemical Mechanical Polishing of Chips
MA Jiahui, CHENG Jie, CHEN Jinchi, JIAN Leizhu
2025, 38(5): 34-59.
https://doi.org/10.11933/j.issn.1007-9289.20241016001
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State-of-the-art and Prospectives of Atomic-level Grinding Technology for Semiconductor Substrates Used in High-end Chips
WANG Haoxiang, KANG Renke, LI Shengbo, DONG Zhigang, GAO Shang
2025, 38(5): 60-82.
https://doi.org/10.11933/j.issn.1007-9289.20250609001
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Advances in Chemical Mechanical Polishing Endpoint Detection Technology for Integrated Circuits Manufacturing
ZHAO Guangen, WANG Chengxin, CHEN Jianxiong, HUANG Yuhua, HUANG Ruochen
2025, 38(5): 83-98.
https://doi.org/10.11933/j.issn.1007-9289.20241202001
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Research on Tribochemical Mechanism in Chemical Mechanical Polishing of GaAs
GAO Jian, REN Xingyun, LIANG Dexu, ZHANG Honglin, ZHOU Huaicheng, JIANG Liang, YU Bingjun, QIAN Linmao
2025, 38(5): 99-106.
https://doi.org/10.11933/j.issn.1007-9289.20241229001
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Effect of Cerium Oxide Abrasives with Different Particle Sizes on the Chemical Mechanical Planarization Performance of K9 Glass
JIANG Feng, QIAN Shanhua, QU Kesong, BIAN Da, NI Zifeng
2025, 38(5): 107-118.
https://doi.org/10.11933/j.issn.1007-9289.20241226002
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