高端芯片用半导体基片原子级磨削技术的研究现状与发展趋势

State-of-the-art and Prospectives of Atomic-level Grinding Technology for Semiconductor Substrates Used in High-end Chips

WANG Haoxiang, KANG Renke, LI Shengbo, DONG Zhigang, GAO Shang

China Surface Engineering . 2025, (5): 60 -82 . DOI: 10.11933/j.issn.1007-9289.20250609001

ISSN 1007-9289　CN 11-3905/TG
Supervised by: China Association for Science and Technology
Sponsored by: Chinese Mechanical Engineering Society
Edited and Published by: Editorial Office of China Surface Engineering

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