State-of-the-art and Prospectives of Atomic-level Grinding Technology for Semiconductor Substrates Used in High-end Chips

WANG Haoxiang, KANG Renke, LI Shengbo, DONG Zhigang, GAO Shang

China Surface Engineering ›› 2025, Vol. 38 ›› Issue (5) : 60-82.

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China Surface Engineering ›› 2025, Vol. 38 ›› Issue (5) : 60-82. DOI: 10.11933/j.issn.1007-9289.20250609001

State-of-the-art and Prospectives of Atomic-level Grinding Technology for Semiconductor Substrates Used in High-end Chips

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2025, 38(5): 60-82 https://doi.org/10.11933/j.issn.1007-9289.20250609001

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ISSN 1007-9289　CN 11-3905/TG
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