超高速直流电沉积制备高质量图形化铜层
李天翔, 袁昊, 蔡文通, 彭洋, 王卿, 陈明祥
Preparation of High-quality Patterned Copper Layer by Ultra-high-speed Direct Current Electrodeposition
LI Tianxiang, YUAN Hao, CAI Wentong, PENG Yang, WANG Qing, CHEN Mingxiang
中国表面工程
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2026, (4): 409
-421
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DOI: 10.11933/CSE2026162
