The Role of Surfactant in the Electroless Copper Plating on Ceramics

ZHU Yan， KONG Xiao–yan， JIANG Qian, WANG Wei–yan

China Surface Engineering ›› 2012, Vol. 25 ›› Issue (1) : 76-82.

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PDF(3343 KB)
China Surface Engineering ›› 2012, Vol. 25 ›› Issue (1) : 76-82.

The Role of Surfactant in the Electroless Copper Plating on Ceramics

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2012, 25(1): 76-82

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ISSN 1007-9289　CN 11-3905/TG
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