The effect of Laser Treatment on the Bonding Strength Between Ceramic Substrate and Cu Electroless Plating layer

SHEN Yi-cheng, XU Zhen-lin, ZHAO Xiong-chao, GU Zhi-jun

China Surface Engineering ›› 2006, Vol. 19 ›› Issue (4) : 28-31.

PDF(287 KB)
PDF(287 KB)
China Surface Engineering ›› 2006, Vol. 19 ›› Issue (4) : 28-31.

The effect of Laser Treatment on the Bonding Strength Between Ceramic Substrate and Cu Electroless Plating layer

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2006, 19(4): 28-31

References

Publishing order | Descend order by publishing year | Descend order by cited within

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(287 KB)

Accesses

Citation

Detail
Sections
Recommended
ISSN 1007-9289　CN 11-3905/TG
Supervised by: China Association for Science and Technology
Sponsored by: Chinese Mechanical Engineering Society
Edited and Published by: Editorial Office of China Surface Engineering
Copyright © China Surface Engineering, All Rights Reserved.
Postal Code: 100037　
Tel: (010)88379020/88379056　
E-mail：cse1988@csejournal.com
Visited
Total visitors:　
Visitors of today: 　
Now online:
京ICP备05060958号-2    Powered by Beijing Magtech Co. Ltd,.

/

〈 〉