Study on Lead-free Weldable Coating of Chip Electronic Components

ZHANG Yin, LI Ji-sen, QI Kun, CHEN Mei, LOU Hong-tao

China Surface Engineering ›› 2005, Vol. 18 ›› Issue (2) : 1-4.

PDF(66 KB)
PDF(66 KB)
China Surface Engineering ›› 2005, Vol. 18 ›› Issue (2) : 1-4.

Study on Lead-free Weldable Coating of Chip Electronic Components

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2005, 18(2): 1-4

References

Publishing order | Descend order by publishing year | Descend order by cited within

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(66 KB)

Accesses

Citation

Detail
Sections
Recommended
ISSN 1007-9289　CN 11-3905/TG
Supervised by: China Association for Science and Technology
Sponsored by: Chinese Mechanical Engineering Society
Edited and Published by: Editorial Office of China Surface Engineering
Copyright © China Surface Engineering, All Rights Reserved.
Postal Code: 100037　
Tel: (010)88379020/88379056　
E-mail：cse1988@csejournal.com
Visited
Total visitors:　
Visitors of today: 　
Now online:
京ICP备05060958号-16    Powered by Beijing Magtech Co. Ltd,.

/

〈 〉