Study on the Composition of Electroless Ni-Cu-P Plating Solution

LIU Bo,HUANG Yan-bin,ZHANG Ping,LIU De-gang,XU Xiao-li,Meng Zhao-fu

China Surface Engineering ›› 2004, Vol. 17 ›› Issue (6) : 36-39.

China Surface Engineering ›› 2004, Vol. 17 ›› Issue (6) : 36-39.

Study on the Composition of Electroless Ni-Cu-P Plating Solution

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2004, 17(6): 36-39

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