Effects of Roughness and Peak Heights on the Chemical Reaction Kinetics Parameters of Rough Copper Wafer Surface

doi:10.3969/j.issn.1007-9289.2014.04.009

LI Yan, LIU Yuling, NIU Xinhuan, WANG Aochen, LI Hongbo

China Surface Engineering ›› 2014, Vol. 27 ›› Issue (4) : 58-63.

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China Surface Engineering ›› 2014, Vol. 27 ›› Issue (4) : 58-63. DOI: 10.3969/j.issn.1007-9289.2014.04.009

Effects of Roughness and Peak Heights on the Chemical Reaction Kinetics Parameters of Rough Copper Wafer Surface

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2014, 27(4): 58-63 https://doi.org/10.3969/j.issn.1007-9289.2014.04.009

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ISSN 1007-9289　CN 11-3905/TG
Supervised by: China Association for Science and Technology
Sponsored by: Chinese Mechanical Engineering Society
Edited and Published by: Editorial Office of China Surface Engineering

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