Effects of Compositions in Plating Solution on the Structure and Deposition Rate of Ni-Sn-P Coatings with High Sn Content

doi:10.3969/j.issn.1007-9289.2014.04.008

FAN Hongyuan, XIAN Guang, GUI Yanhua, GU Tan, WANG Jun, WU Hua

China Surface Engineering ›› 2014, Vol. 27 ›› Issue (4) : 49-57.

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China Surface Engineering ›› 2014, Vol. 27 ›› Issue (4) : 49-57. DOI: 10.3969/j.issn.1007-9289.2014.04.008

Effects of Compositions in Plating Solution on the Structure and Deposition Rate of Ni-Sn-P Coatings with High Sn Content

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2014, 27(4): 49-57 https://doi.org/10.3969/j.issn.1007-9289.2014.04.008

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ISSN 1007-9289　CN 11-3905/TG
Supervised by: China Association for Science and Technology
Sponsored by: Chinese Mechanical Engineering Society
Edited and Published by: Editorial Office of China Surface Engineering

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