Advances in Chemical Mechanical Polishing Endpoint Detection Technology for Integrated Circuits Manufacturing

ZHAO Guangen, WANG Chengxin, CHEN Jianxiong, HUANG Yuhua, HUANG Ruochen

China Surface Engineering ›› 2025, Vol. 38 ›› Issue (5) : 83-98.

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China Surface Engineering ›› 2025, Vol. 38 ›› Issue (5) : 83-98. DOI: 10.11933/j.issn.1007-9289.20241202001

Advances in Chemical Mechanical Polishing Endpoint Detection Technology for Integrated Circuits Manufacturing

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2025, 38(5): 83-98 https://doi.org/10.11933/j.issn.1007-9289.20241202001

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ISSN 1007-9289　CN 11-3905/TG
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Sponsored by: Chinese Mechanical Engineering Society
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