Molecular Dynamics of the Grinding and Polishing Collaborative-processing on Monocrystalline Silicon

doi:10.11933/j.issn.1007-9289.20230315001

GUO Lei, GUO Pengju, LIU Tiangang, GUO Wanjin, Lü Jingxiang, JIN Qichao

China Surface Engineering ›› 2024, Vol. 37 ›› Issue (2) : 199-210.

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China Surface Engineering ›› 2024, Vol. 37 ›› Issue (2) : 199-210. DOI: 10.11933/j.issn.1007-9289.20230315001

Molecular Dynamics of the Grinding and Polishing Collaborative-processing on Monocrystalline Silicon

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 37(2): 199-210 https://doi.org/10.11933/j.issn.1007-9289.20230315001

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ISSN 1007-9289　CN 11-3905/TG
Supervised by: China Association for Science and Technology
Sponsored by: Chinese Mechanical Engineering Society
Edited and Published by: Editorial Office of China Surface Engineering

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Received	Revised	Published
2023-03-15	2023-09-18	2024-04-20
Issue Date
2024-04-20

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