Application of Thermal Spray Ni Barrier Layer in Bismuth Telluride Thermoelectric Devices

doi:10.11933/j.issn.1007-9289.20220813002

MA Yan, KUANG Zhixiang, HAN Xuewu, HU Xiaoming, LI Yawei, FAN Xian

China Surface Engineering ›› 2023, Vol. 36 ›› Issue (3) : 214-222.

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China Surface Engineering ›› 2023, Vol. 36 ›› Issue (3) : 214-222. DOI: 10.11933/j.issn.1007-9289.20220813002

Application of Thermal Spray Ni Barrier Layer in Bismuth Telluride Thermoelectric Devices

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 36(3): 214-222 https://doi.org/10.11933/j.issn.1007-9289.20220813002

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ISSN 1007-9289　CN 11-3905/TG
Supervised by: China Association for Science and Technology
Sponsored by: Chinese Mechanical Engineering Society
Edited and Published by: Editorial Office of China Surface Engineering

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