Numerical Simulation of Substrate Roughness on the Interface Bonding of Cold-sprayed Ti6Al4V

doi:10.11933/j.issn.1007-9289.20211112001

JIANG Shengwei, ZHOU Hongxia, LI Xueting, WANG You

China Surface Engineering ›› 2022, Vol. 35 ›› Issue (3) : 262-272.

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China Surface Engineering ›› 2022, Vol. 35 ›› Issue (3) : 262-272. DOI: 10.11933/j.issn.1007-9289.20211112001

Numerical Simulation of Substrate Roughness on the Interface Bonding of Cold-sprayed Ti6Al4V

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 35(3): 262-272 https://doi.org/10.11933/j.issn.1007-9289.20211112001

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ISSN 1007-9289　CN 11-3905/TG
Supervised by: China Association for Science and Technology
Sponsored by: Chinese Mechanical Engineering Society
Edited and Published by: Editorial Office of China Surface Engineering

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