Molecular Dynamics Simulation on the Material Removal Mechanism in the Nano-polishing Process of Invar Alloy

doi:10.11933/j.issn.1007-9289.20210826002

WANG Wan, ZHOU Qing, HUA Dongpeng, LI Shuo, WANG Zhijun, WANG Haifeng

China Surface Engineering ›› 2021, Vol. 34 ›› Issue (6) : 160-167.

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China Surface Engineering ›› 2021, Vol. 34 ›› Issue (6) : 160-167. DOI: 10.11933/j.issn.1007-9289.20210826002

Molecular Dynamics Simulation on the Material Removal Mechanism in the Nano-polishing Process of Invar Alloy

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 34(6): 160-167 https://doi.org/10.11933/j.issn.1007-9289.20210826002

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ISSN 1007-9289　CN 11-3905/TG
Supervised by: China Association for Science and Technology
Sponsored by: Chinese Mechanical Engineering Society
Edited and Published by: Editorial Office of China Surface Engineering

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