Role of Surface Technology Such as Electrodeposition in Integrated Circuit Manufacturing

doi:10.11933/j.issn.1007-9289.20210429004

Zhu Jing, Zhuo Hongjun, Zhu Liqun

China Surface Engineering ›› 2022, Vol. 35 ›› Issue (4) : 248-256.

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China Surface Engineering ›› 2022, Vol. 35 ›› Issue (4) : 248-256. DOI: 10.11933/j.issn.1007-9289.20210429004

Role of Surface Technology Such as Electrodeposition in Integrated Circuit Manufacturing

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 35(4): 248-256 https://doi.org/10.11933/j.issn.1007-9289.20210429004

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ISSN 1007-9289　CN 11-3905/TG
Supervised by: China Association for Science and Technology
Sponsored by: Chinese Mechanical Engineering Society
Edited and Published by: Editorial Office of China Surface Engineering

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