Effects of Mechanism Analysis for Spherical Contact Pair on Contact Deformation in Copper Film from Nano-perspective∗

doi:10.11933/j.issn.1007-9289.20210318001

CHEN Jingjing, WENG Shengbin, WU Hao

China Surface Engineering ›› 2021, Vol. 34 ›› Issue (4) : 99-106.

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China Surface Engineering ›› 2021, Vol. 34 ›› Issue (4) : 99-106. DOI: 10.11933/j.issn.1007-9289.20210318001

Effects of Mechanism Analysis for Spherical Contact Pair on Contact Deformation in Copper Film from Nano-perspective∗

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 34(4): 99-106 https://doi.org/10.11933/j.issn.1007-9289.20210318001

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ISSN 1007-9289　CN 11-3905/TG
Supervised by: China Association for Science and Technology
Sponsored by: Chinese Mechanical Engineering Society
Edited and Published by: Editorial Office of China Surface Engineering

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