Effects of Current Density on Residual Resistivity Ratio of Electrodeposited Copper Films

doi:10.11933/j.issn.1007-9289.20210201001

ZHANG Shuai, LUO Jirun, WANG Xiaoxia, ZHANG Rui, WU Zhijie, FENG Haijiao

China Surface Engineering ›› 2021, Vol. 34 ›› Issue (4) : 60-66.

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China Surface Engineering ›› 2021, Vol. 34 ›› Issue (4) : 60-66. DOI: 10.11933/j.issn.1007-9289.20210201001

Effects of Current Density on Residual Resistivity Ratio of Electrodeposited Copper Films

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 34(4): 60-66 https://doi.org/10.11933/j.issn.1007-9289.20210201001

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ISSN 1007-9289　CN 11-3905/TG
Supervised by: China Association for Science and Technology
Sponsored by: Chinese Mechanical Engineering Society
Edited and Published by: Editorial Office of China Surface Engineering

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