Effects of Target-substrate Distance on Structure and Residual Stress of Cu / Si(100) Thin Films

doi:10.11933/j.issn.1007-9289.20190910002

Meng Di, Jiang Zhitao, Li Yuge, Gao Jianying, Lei Mingkai

China Surface Engineering ›› 2020, Vol. 33 ›› Issue (6) : 86-92.

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China Surface Engineering ›› 2020, Vol. 33 ›› Issue (6) : 86-92. DOI: 10.11933/j.issn.1007-9289.20190910002

Effects of Target-substrate Distance on Structure and Residual Stress of Cu / Si(100) Thin Films

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2020, 33(6): 86-92 https://doi.org/10.11933/j.issn.1007-9289.20190910002

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ISSN 1007-9289　CN 11-3905/TG
Supervised by: China Association for Science and Technology
Sponsored by: Chinese Mechanical Engineering Society
Edited and Published by: Editorial Office of China Surface Engineering

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