Ultrasonic Testing Numerical Simulation of Debonding Defect in Thermal Barrier Coatings Considering Void Microscopic Parameters

ZHANG Wei, MA Zhi-yuan, GAO Jian-ying, LIN Li and LEI Ming-kai

China Surface Engineering ›› 2017, Vol. 30 ›› Issue (3) : 115-121.

PDF(2508 KB)
PDF(2508 KB)
China Surface Engineering ›› 2017, Vol. 30 ›› Issue (3) : 115-121. DOI: 10.11933/j.issn.1007-9289.20161228002

Ultrasonic Testing Numerical Simulation of Debonding Defect in Thermal Barrier Coatings Considering Void Microscopic Parameters

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2017, 30(3): 115-121 https://doi.org/10.11933/j.issn.1007-9289.20161228002

References

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(2508 KB)

Accesses

Citation

Detail

Sections
Recommended

/