Application of Magnetic Field Simulation on Magnetron Sputtering and Cathodic Arc Ion Plating Deposition Techniques

doi:10.11933/j.issn.1007-9289.2015.02.002

LEI Hao, XIAO Jinquan, LANG Wenchang, ZHANG Xiaobo, GONG Jun, SUN Chao

China Surface Engineering ›› 2015, Vol. 28 ›› Issue (2) : 27-44.

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China Surface Engineering ›› 2015, Vol. 28 ›› Issue (2) : 27-44. DOI: 10.11933/j.issn.1007-9289.2015.02.002

Application of Magnetic Field Simulation on Magnetron Sputtering and Cathodic Arc Ion Plating Deposition Techniques

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2015, 28(2): 27-44 https://doi.org/10.11933/j.issn.1007-9289.2015.02.002

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ISSN 1007-9289　CN 11-3905/TG
Supervised by: China Association for Science and Technology
Sponsored by: Chinese Mechanical Engineering Society
Edited and Published by: Editorial Office of China Surface Engineering

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