Preparation of High-quality Patterned Copper Layer by Ultra-high-speed Direct Current Electrodeposition

LI Tianxiang, YUAN Hao, CAI Wentong, PENG Yang, WANG Qing, CHEN Mingxiang

China Surface Engineering ›› 2026, Vol. 39 ›› Issue (4) : 409-421.

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China Surface Engineering ›› 2026, Vol. 39 ›› Issue (4) : 409-421. DOI: 10.11933/CSE2026162

Preparation of High-quality Patterned Copper Layer by Ultra-high-speed Direct Current Electrodeposition

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2026, 39(4): 409-421 https://doi.org/10.11933/CSE2026162

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ISSN 1007-9289　CN 11-3905/TG
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