
电压和占空比对TC4合金表面碳氮共渗层组织与性能影响
The Effect of Voltage and Duty Cycle on the Micro–structure and Performance of Plasma Carbonitriding Layer on the Surface of TC4 Alloy
{{custom_ref.label}} |
{{custom_citation.content}}
{{custom_citation.annotation}}
|
/
〈 |
|
〉 |