| 摘要: |
| 为了进一步研究TC4钛合金在直流液相等离子体法强化过程中的温度变化，探索强化层的生长过程，通过液相等离子体电解强化技术在TC4钛合金表面制备强化层。使用热电偶测量强化过程中的试样温度变化，通过扫描电子显微镜(SEM)、能谱仪（EDS）、显微硬度等测试方法分别研究强化层的表面形貌、显微结构、元素分布和硬度。结果表明，较高的试样温度(约500 ℃)有利于TC4钛合金得到表面完整、均匀的强化层，而260 V左右的处理电压能使试样达到该温度。表面化合物层以Ti(C,N)相为主，化合物层下有碳氮元素渗入基体。经过处理的强化层硬度较基体明显提升，近表层硬度可达784 HV0.01。研究表明，TC4钛合金强化层的生长分为4个阶段：基材预热阶段、初步起弧阶段、表面弧光渗氮阶段和碳氮化合物层向外生长阶段。 |
| 关键词: 钛合金； 直流液相等离子体法； Ti(C,N) 强化层； 生长 |
| DOI：10.11933/j.issn.1007-9289.2015.06.008 |
| 分类号: |
| 基金项目: |
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| Growth of Strengthening Layer on TC4 Titanium Alloy by DC Plasma in Liquid Phase |
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YAN Pengqing, LU Wenzhuang, LIU Sen, PAN Hanfei, ZHANG Wuhui, ZUO Dunwen
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a. College of Mechanical and Electrical Engineering, b. Jiangsu Key Laboratory of Precision and Micromanufacturing Technology, Nanjing University of Aeronautics and Astronautics
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| Abstract: |
| To further study the temperature variation and growth of a strengthening layer, the strengthening layer of the TC4 titanium alloy was prepared by DC plasma technology. A thermocouple was used to measure the temperature variation in the process. The morphology, structure, element distribution and hardness were studied by SEM, EDS and microhardness tester respectively. The results show that high sample temperature (about 500 ℃) is in favorable for TC4 to obtain the uniform strengthening layer. The best treatment voltage is about 260 V. The compound layer is composed of Ti(C,N). The carbon and nitrogen atom diffuse into the substrate. The hardness of the top layer is about 784 HV0.01, which significantly increases compared with the substrate. The growth of the strengthening layer on TC4 can be divided into four stages: preheating period, preliminaryarc period, arc discharge nitriding period and the strengthening layer outward the growth period. |
| Key words: titanium alloy DC plasma in liquid phase Ti(C,N) strengthening layer growth |
