| 摘要: |
| 采用循环伏安法（CV）测试，结合量子化学计算和扫描电子显微镜(SEM)分析，研究了配位剂丁二酰亚胺对银电沉积过程的影响。结果表明： Ag+与丁二酰亚胺配位后，还原电位负移。不同丁二酰亚胺浓度和pH值条件下，丁二酰亚胺与Ag 形成的配合物形式以及配合物稳定性均不同。随着丁二酰亚胺浓度增大以及pH值升高，形成的配合物也更稳定。当pH为10时，丁二酰亚胺与Ag 能够形成稳定的配合物［Ag(C4H4NO2)2］-、［Ag(C4H4NO2)3］2-和［Ag2(C4H4NO2)4］2-。在适宜的电位范围内能够制备出结构致密、表面平整的银镀层。 |
| 关键词: 银离子 电沉积 丁二酰亚胺 配合物体系 |
| DOI：10.3969/j.issn.1007-9289.2014.05.004 |
| 分类号: |
| 基金项目: |
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| Silver Electrodeposition Process in Succinmide Solution |
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ZHU Yaping, WANG Wei
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School of Chemical Engineering and Technology, Tianjin University, Tianjin 300072
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| Abstract: |
| Effects of succinimide on the electrochemical reduction process of Ag+ in solution were investigated by cyclic voltammetry (CV), quantum chemical calculation and scanning electron microscope (SEM). The results show that reduction potential of Ag negatively shifts with the addition of complexing agent. Variation of the solution pH and complexing agent concentration affects the complex forms and stability. The compound complexed by succinimide and Ag is more stable when the complexing agent concentration and pH is higher. Ag are reduced as the form of ［Ag(C4H4NO2)2］-, ［Ag(C4H4NO2)3］2- and ［Ag2(C4H4NO2)4］2- that are stable in the succinimide solution when pH is 10. The coating obtained under the optimum conditions is compact smooth. |
| Key words: silver ion electrodeposition succinimide complexing |
