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合金镀铁层的结合和强化机理研究
董文仲1,2,阎 军1,2,贾珊中1,2,刘 勇1,2,董文胜1,2,董玉华1,21,2
1. 大连海事大学董氏镀铁有限公司;2. 辽宁省镀铁工程技术研究中心
摘要:
铁元素资源丰富、价格便宜,推广镀铁技术符合国家可持续发展战略要求。合金镀铁技术是在无刻蚀镀铁工艺的基础上,在镀铁液中加入一定量的Ni和Co,沉积成含有Ni和Co的合金镀铁层。施镀工艺采用电压控制方式,镀前对基体金属表面进行对称交流活化,使基体金属表面形成“微融活化态”,合金镀铁层与基体金属完全融为一体的金属键结合,其力学性能显著提高,结合强度可达460 MPa。能够满足在高速运转和高密度承载的条件下使用要求,并在大量工业应用中得到证实。在机电产品再制造中,合金镀铁具有广阔的应用前景。文中通过对合金镀铁层和单金属镀铁层用扫描电镜观察检验、法向拉力试验和耐磨性能试验,分析并讨论了合金镀铁层的结合和强化机理。
关键词:  铁基合金  电镀  微融  活化态  金属键结合
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Research on the Bonding and Strengthening Mechanism of Iron–based Alloy Plated Layers
DONG Wen–zhong1,2, YAN Jun1,2, JIA Shan–zhong1,2, LIU Yong1,2, DONG Wen–sheng1,2, DONG Yu–hua1,21,2
1. Dong’s Iron Plating Co., Ltd. Of Dalian Maritime University;2. Iron Plating Technology Research Center of Liaoning Province
Abstract:
Ferrum is a kind of cheap and abundant resources, and popularizing iron plating technology to remanufacture mechanical and electrical products is up to the national strategy of sustainable development. Iron–based alloy plating remanufacture technology is a kind of technology which developed from iron plating without etching technology. In order to get iron–based alloy plating layers, nickle and cobalt were Added into the plating solution. Volt–control mode was adopted and the symmetrical AC activating procedure on the surface of metrix metal was finished before plating to get “Micro Melt Activation” which make the bond of the iron–based alloy plated layer and metallic matrix to a whole. Iron–based alloy plating layers with excellent mechanical properties is a good remanufacture technology. And the interface bonding strength could reach to 460 MPa. Plenty of applied cases in the remanufactured mechanical and electrical products proved that the iron–based alloy plating layers could completely satisfied the requirement under high running and high density loading conditions. The bonding and strengthening mechanism of the iron–based alloy plated layers was discussed by scanning electron microscopy, heave tensile test and wear resisting test.
Key words:  iron–based alloy  plating  micro melt  activation  metallic bonding