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YG6硼化综合处理后基体温度对金刚石薄膜的影响
魏秋平,余志明,马莉,胡德莹,李媛,刘王平,肖和
中南大学材料科学与工程学院,中南大学材料科学与工程学院,中南大学粉末冶金国家重点实验室,中南大学材料科学与工程学院,中南大学材料科学与工程学院,中南大学材料科学与工程学院,株洲硬质合金集团有限公司 长沙410083,长沙410083,长沙410083,长沙410083,长沙410083,长沙410083株洲硬质合金集团有限公司,株洲412000,株洲412000
摘要:
采用热丝化学气相沉积(HFCVD)方法,以甲烷和氢气为反应气体,在经950℃×6h硼化综合处理后的YG6(WC–6%Co)硬质合金基体上制备了金刚石膜。使用场发射扫描电子显微镜(FESEM)和X射线衍射仪(XRD)对金刚石薄膜进行检测分析、对比,研究了基体温度对金刚石薄膜形貌和生长织构的影响,比较了硼化综合处理与二步法处理对金刚石薄膜附着性能的影响。结果表明,当沉积气压为2.67kPa,碳源浓度为3.3%时,薄膜表面形貌和生长织构随着基体温度改变有明显的变化,硼化综合处理较二步法预处理更加有效地改善了膜–基附着性能。
关键词:  金刚石薄膜  硬质合金  基体温度  硼化处理  附着性能
DOI:
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基金项目:
Effect of Substrate Temperature on Diamond Film on Boronized WC-6%Co Substrate
WEI Qiu-ping,YU Zhi-ming,MA Li,HU De-ying,LI Yuan,LIU Wang-ping,XIAO He1,2,3
1.School of Materials Science and Engineering, Central South University, Changsha 410083;2.Key State Laboratory of Powder Metallurgy, Central South University, Changsha 410083;3. Zhuzhou Cemented Carbide Group Corporation, Zhuzhou 412000
Abstract:
The diamond film was deposited on a boronized WC–6%Co substrate via hot filament chemical vapor deposition. The surface morphology, composition and adhesion of the diamond film were investigated by means of field emission scanning electron microscope (FESEM), X–ray diffractometer (XRD) and Rockwell hardness tester, respectively. The results showed that a cobalt boride layer was formed on the surface at 950℃. The layer can effectively reduce the diffusion of Co from substrate to surface during the deposition of diamond films. Comparing with the two-step pretreatment, the boronizing is much better to improve the adhesion.
Key words:  diamond films  cemented carbide  substrate temperature  boronizing pretreatment  adhesion