| 摘要: |
| 为了获得平整的光纤阵列端面,设计了一套超声椭圆振动辅助化学抛光系统,并进行常规化学机械抛光和超声椭圆振动辅助化学机械抛光的对照试验。结果表明,应用超声椭圆振动辅助化学机械抛光技术加工光纤阵列,选择合理的抛光工艺参数,可获得质量较好的光纤阵列端面,相比于常规化学机械抛光技术,光纤的表面粗糙度降低了25%。采用单因素试验法,分别研究了抛光粒子材料及抛光液酸碱性对于超声椭圆振动辅助化学机械抛光的作用效果,并利用Vecco表面轮廓仪对抛光后光纤阵列端面进行观察和分析。采用正交试验法获得了一组超声椭圆振动辅助化学机械抛光光纤阵列的优化工艺参数,最佳工艺参数组为:超声振动频率25 kHz,抛光液流量35 mL/min,抛光压力50 kPa,抛光盘转速20 r/min,抛光粒子质量分数0.5%。 |
| 关键词: 光纤阵列 超声椭圆振动 化学机械抛光 表面粗糙度 |
| DOI：10.11933/j.issn.1007-9289.2016.03.018 |
| 分类号: |
| 基金项目:国家自然科学基金(51275534);湖南省自然科学基金(2015JJ2153) |
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| Ultrasonic Elliptical Vibration Assisted Chemical Mechanical Polishing for Fiber Array |
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CHEN Tao1,2, LIU De-fu1,2, SHE Yi-xi1, YAN Ri-ming1
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1.College of Mechanical and Electrical Engineering, Central South University, Changsha 410083;2.State Key Laboratory of high performance complex manufacturing, Central South University, Changsha 410083
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| Abstract: |
| In order to obtain a flat end face of fiber array, an ultrasonic elliptic vibration assisted chemical polishing system is designed, which is used for conducting a controlled trial between routine chemically mechanical polishing and the ultrasonic elliptic vibration assisted chemical mechanical polishing. The experiments shows that applying ultrasonic elliptic vibration assisted chemical mechanical polishing to process fiber array with reasonable process parameters can get better quality of end face of which roughness declines 25% compared with using routine chemically mechanical polishing. Via single factor experiments, we do the researches of analyzing the effect to ultrasonic elliptic vibration assisted chemical mechanical polishing by controlling two factors, polishing particle and the pH of the polishing solution. And we also utilize Vecco surface profiler to assay and observe the polished end face of fiber array. Orthogonal experiment method is used to get a group of process parameters of ultrasonic elliptic vibration assisted chemical mechanical polishing fiber array, which is that the frequency of ultrasonic is 25 kHz, the flow quantity of polishing solution is 35 mL/min, the pressure of polishing is 50 kPa, the speed of the polishing disc is 20 r/min, the mass fraction of the polishing particle is 0.5%. |
| Key words: fiber array ultrasonic elliptical vibration chemical mechanical polishing surface roughness |
