| 摘要: |
| 通过研究在镀液中添加十六烷基三甲基溴化铵(CTAB)、十二烷基硫酸钠(SDS)和吐温–80三种表面活性剂对化学镀铜沉积速率和镀液稳定性的影响，确定出三种添加剂的最优添加浓度。通过扫描电镜、能谱分析仪和X射线衍射仪，对镀层表面形貌、组成成分以及晶体结构分别进行研究。并通过线性伏安扫描法，研究了添加不同表面活性剂镀液的电化学行为。结果表明：表面活性剂可以提高化学镀铜的沉积速率和镀液稳定性。CTAB、SDS和吐温–80的最优添加浓度分别为1 mg/L、20 mg/L和5 mg/L。加入SDS后，由于沉积速率过大，使得镀层颗粒变大。加入CTAB和吐温–80可以细化镀层的颗粒且更加致密。添加不同的表面活性剂后，镀层的晶粒尺寸没有太大改变，含铜量均为100%且镀层的晶粒呈现面心立方晶体结构。表面活性剂主要通过影响甲醛的氧化反应影响化学镀铜过程。 |
| 关键词: 表面活性剂 化学镀铜 镀液稳定性 镀层性能 |
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| The Role of Surfactant in the Electroless Copper Plating on Ceramics |
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ZHU Yan， KONG Xiao–yan， JIANG Qian, WANG Wei–yan
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College of Chemical Engineering, Wuhan University of Technology, Wuhan 430070
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| Abstract: |
| Effect of adding CTAB, SDS and Tween–80 in the electroless copper plating bath on the deposition rate and bath stability were studied in this work. The optimal concentration of the three kinds of additives has been determined. The surface morphology, composition and crystal structure of the copper deposits was estimated by SEM, EDS and XRD, respectively. The electrochemical behavior of plating bath containing different surfactants was investigated by the linear sweep voltammetry. The results show that the addition of surfactants, which significantly increases the deposition rate and improves the stability of plating bath. The optimal concentration of CTAB, SDS and Tween80 is 1mg/L, 20mg/L and 5mg/L, respectively. Adding SDS magnified the particles of copper deposits for increasing the deposition rate. Adding CTAB and Tween–80 thinned and densified the particles of copper deposits. The crystal size of the copper deposits has changed slightly. The copper deposits contain 100% of copper and its crystal particles have the characteristics of a facecentered cubic crystalline structure. The LSV shows that surfactant improve the process of electroless copper plating by enhancing the catalytic oxidation of formaldehyde, densifying the particles of copper deposits. |
| Key words: surfactant electroless copper plating bath stability plating performance |
