| 摘要: |
| 针对了片式多层陶瓷电容器(MLCC)三层镀甲基磺酸镀纯锡体系，提高镀液中Sn2+ 离子浓度、添加剂浓度及增大阴极电流密度对电流效率、沉积速度、最大允许电流密度及镀层性能等几个方面的影响。结果表明，提高Sn2+离子浓度和阴极电流密度后，添加剂I按Sn2+离子浓度比例相应提高，添加剂II浓度不变，阴极电流密度提高至0.3～0.35 A/dm2，沉积速度加快，即镀得相同厚度的镀层，其电镀时间可比原来工艺缩短三分之一，收到缩短电镀生产周期、提高生产设备利用率的效果。 |
| 关键词: 甲基磺酸 镀锡体系 沉积速度 离子浓度 |
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| Study on Influence of Processing Conditions of Methanesulfonic Tin-plating System on Tin Coating Performance in MLCC Three-Layer Plating （continue） |
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FENG Hui, LOU Hong-tao, LI Ji-sen, YANG Wei-hua, CHEN Mei
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Guangdong FengHua Advanced Technology Holding CO.,LTD, Zhaoqing Guangdong 526020
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| Abstract: |
| As to methanesulfonic tin plating system in MLCC(Multilayer Ceramic Capacitor) three-layer plating, this paper, studied the influence of enhancing Sn2+concentration, additive concentration and current density of cathode on current efficiency, deposition rate, maximum allowable current density and coating performance. The result showed that after enhancing Sn2+concentration and current density of cathode, the concentration of additive I was increased as Sn2+concentration, additiveⅡ was unchanged, the current density of cathode was going up to 0.3～0.35 A/dm2, then the deposition rate was accelerated, that is to say, the time required for plating the coating of same thickness was reduced to one third of the original process. So that the purpose of cutting down plating production cycle and increasing the utilization rate of production facility was accomplished. |
| Key words: methanesulfonic tin-plating system deposition rate ion concentration |
