| 引用本文: | 蒋智韬,高剑英,雷明凯.微米压痕测量TiAlN薄膜断裂韧性的数字孪生方法[J].中国表面工程,2022,35(5):172~183 |
| JIANG Zhitao,GAO Jianying,LEI Mingkai.Measurement of Fracture Toughness of TiAlN Thin Film by Micro Indentation Based on Digital Twin[J].China Surface Engineering,2022,35(5):172~183 |
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| 摘要: |
| 针对高性能表面层制造的薄膜断裂韧性检测，采用扩展有限元法(XFEM)模拟 TiAlN 薄膜微米压痕行为，基于数字孪生方法优化薄膜最大起始断裂应力(σmax)和相应的裂纹分离距离(δc)参数，根据 Griffith-Irwin 关系测定薄膜断裂韧性。 深振荡磁控溅射(DOMS)在 AISI 304 奥氏体不锈钢基体上沉积具有立方结构的 TiAlN 薄膜，随着峰值功率由 58.7 kW 增至 129.9 kW，薄膜的择优取向由(111)转变为(200)。维氏微米压痕试验在载荷 500 mN 下压制，聚焦离子束(FIB)结合扫描电子显微镜(SEM)观察薄膜平面和横截面开裂行为，通过 3D XFEM 建模表征薄膜损伤过程，将模拟的薄膜裂纹形态、 数量、分布及总长度与试验值进行交互反馈和融合分析，孪生匹配出薄膜平面开裂的σmax 和δc参数，计算出 AISI 304 奥氏体不锈钢上沉积 TiAlN 薄膜的断裂韧性。随着 DOMS 峰值功率提高，TiAlN 薄膜断裂韧性先增加后减小。峰值功率为 90.2 kW， 伴随最高纳米硬度 28.3 GPa，断裂韧性最大值为 1.88 MPa·m1/2，DOMS 沉积 TiAlN 薄膜具有强韧性复合性能。XFEM 模拟微米压痕的数字孪生方法，不仅发展了薄膜断裂韧性的测量技术，还为高性能表面层制造反问题提供了一种求解方法。 |
| 关键词: TiAlN 薄膜 断裂韧性 深振荡磁控溅射 数字孪生 微米压痕 |
| DOI：10.11933/j.issn.1007?9289.20220601001 |
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| 基金项目:国家自然科学基金重点联合资助项目(U21B2078) |
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| Measurement of Fracture Toughness of TiAlN Thin Film by Micro Indentation Based on Digital Twin |
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JIANG Zhitao, GAO Jianying, LEI Mingkai
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Surface Engineering Laboratory, Dalian University of Technology, Dalian 116024 , China
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| Abstract: |
| Micro indentation of TiAlN thin film is simulated by an extended finite element method (XFEM) to measure the fracture toughness of surface layer by high-performance manufacturing. The fracture toughness of thin film is obtained according to Griffith-Irwin relationship with the maximum damage initiation stress (σmax) and corresponding crack separation distance (δc) that are optimized based on the digital twin. The cubic TiAlN thin film on the AISI 304 austenitic stainless steel substrate are deposited by the deep oscillation magnetron sputtering (DOMS). The preferred orientation of TiAlN thin film changed from (111) to (200) at the peak powers from 58.7 kW to 129.9 kW. The micro Vickers indentation is pressed with a load of 500 mN. The planar and cross-sectional cracks of thin film are observed by the focused ion beam (FIB) combined with scanning electron microscope (SEM). The damage process of TiAlN thin film on the stainless steel substrate is characterized by 3D XFEM modeling. The crack morphology, number and distribution, and total crack length are compared between the simulated and experimental results, through an interactive feedback and combination analysis. The σmax and δc of thin film in plane cracking are matched and therefore, the fracture toughness of TiAlN thin film on stainless steel substrate is calculated. With the DOMS peak power, the fracture toughness of TiAlN thin film increased and then decreased with a maximum value of 1.88 MPa·m1/2 at the peak power of 90.2 kW, where there is a maximum nanohardness of 28.6 GPa. A combinedly improvement of hardness and fracture toughness is obtained on the TiAlN thin film on the AISI 304 austenitic stainless steel substrate. The digital twin based on XFEM simulating micro indentation not only developed the measurement of fracture toughness of thin film, but also provided a useful solution to the inverse problem of high-performance surface layer manufacturing. |
| Key words: TiAlN thin film fracture toughness deep oscillation magnetron sputtering digital twin micro indentation |
