引用本文:朱晶,卓鸿俊,朱立群.电化学沉积等表面技术在集成电路制造中的作用[J].中国表面工程,2022,35(4):248~256
Zhu Jing,Zhuo Hongjun,Zhu Liqun.Role of Surface Technology Such as Electrodeposition in Integrated Circuit Manufacturing[J].China Surface Engineering,2022,35(4):248~256
【打印本页】   【HTML】   【下载PDF全文】   【查看/发表评论】  【EndNote】   【RefMan】   【BibTex】
←前一篇|后一篇→ 过刊浏览    高级检索
本文已被：浏览 1276次   下载 1519次 本文二维码信息
码上扫一扫！
分享到： 微信 更多
字体:加大+|默认|缩小-
电化学沉积等表面技术在集成电路制造中的作用
朱晶1,2, 卓鸿俊2, 朱立群3
1.北京国际工程咨询有限公司 北京 100055;2.北京半导体行业协会 北京 100191;3.北京航空航天大学材料与工程学院 北京 100083
摘要:
集成电路制造也称芯片制造，在整个工业产业链中越来越重要，而电化学沉积(电镀)等表面技术起到非常关键的作用。介绍芯片制造中用到的电化学沉积、物理气相沉积(PVD)、化学气相沉积(CVD)、抛光等表面技术的基本情况和特点， 探讨铜互连电镀、化学机械抛光(CMP)、硅通孔(TSV)垂直互连电镀铜填充、芯片表面再布线(RDL)电镀铜工艺、键合凸点(Bump)电镀铜/锡工艺、集成电路引线框架/封装基板的电化学蚀刻工艺等，通过总结电化学沉积等表面技术的发展， 深入分析传统电镀技术在集成电路制造中的新特点，推动集成电路制造技术的进步。
关键词:  集成电路制造  电化学沉积  铜互连电镀  PCB 线路板电镀  表面技术
DOI：10.11933/j.issn.1007-9289.20210429004
分类号:TN304
基金项目:
Role of Surface Technology Such as Electrodeposition in Integrated Circuit Manufacturing
Zhu Jing1,2, Zhuo Hongjun2, Zhu Liqun3
1.Beijing International Engineering Consulting Company,Beijing 100055 ,China;2.Beijing Semiconductor Industry Association,Beijing 100191 , China;3.School of Materials and Engineering, Beihang University, Beijing 100083 , China
Abstract:
Integrated circuit manufacturing, also called chip manufacturing, is becoming more and more important to the entire industrial chain, and surface technologies such as electrochemical deposition (electroplating) have played a very key role.This paper introduces surface technologies such as electrochemical deposition, physical vapor deposition(PVD), chemical vapor deposition(CVD), and polishing used in integrated circuit manufacturing. And many processes such as the copper interconnect electroplating, chemical mechanical polishing (CMP), through silicon via (TSV) vertical interconnect electroplating copper filling.Chip surface rewiring (RDL) copper electroplating process, bonding bump (Bump) electroplating copper/tin process, integrated circuit lead frame/package substrate electrochemical etching process, etc are also discussed.This paper aims to summarize the development of surface technologies such as electrochemical deposition, deeply analyze the new characteristics of traditional electroplating technology in integrated circuit manufacturing, and promote the progress of integrated circuit manufacturing technology.
Key words:  integrated circuit manufacturing  electrochemical deposition  copper interconnect electroplating  PCB circuit board electroplating  surface technology
手机扫一扫看