引用本文:李明君,马永,高洁,毛雅梅,周兵,于盛旺.高导热金刚石/铜复合材料研究进展[J].中国表面工程,2022,35(4):140~150
Li Mingjun,Ma Yong,Gao Jie,Mao Yamei,Zhou Bing,Yu Shengwang.Research Progress of Diamond / Cu Composites for Thermal Management[J].China Surface Engineering,2022,35(4):140~150
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高导热金刚石/铜复合材料研究进展
李明君1, 马永1, 高洁1,2, 毛雅梅1, 周兵1, 于盛旺1
1.太原理工大学材料科学与工程学院 太原 030024;2.电子科学技术大学真空电子科学技术国家重点实验室 成都 610054
摘要:
金刚石 / 铜复合材料兼具低密度、高导热率数和可调热膨胀系数等优点，近年来成为新一代热管理材料的研究重点。 通过理论、试验及模拟三个方向对金刚石 / 铜复合材料进行综述。回顾金刚石 / 铜复合材料的发展历程，总结金刚石 / 铜复合材料重要的颗粒混合理论模型及“三明治”复合结构经验公式，研究影响热导率和热膨胀系数等两大热学性能指标的重要因素，简述有限元模拟在金刚石 / 铜复合材料中的相关应用。其中，重点分析界面改性(活性改性元素种类和改性层厚度)对金刚石 / 铜复合材料导热性的影响。结果表明，通过界面改性、增加接触面积以及在较高温度和压力机制驱动下制备的金刚石 / 铜复合材料具有优异的热物理性能。最后由所得结论提出双峰金刚石、渗碳、大尺寸金刚石自支撑膜表面织构化等方法， 可用来提升金刚石 / 铜复合材料界面结合强度和散热性能。
关键词:  金刚石 / 铜复合材料  理论模型  界面改性  有限元模拟  热导率  热膨胀系数
DOI：10.11933/j.issn.1007-9289.20211113001
分类号:TG156;TB114
基金项目:国家自然科学基金(51901154)、山西省科技重大专项(20181102013)、山西省自然科学基金(201901D211092)和山西省高等学校科技成果转化培育(2020CG011)资助项目
Research Progress of Diamond / Cu Composites for Thermal Management
Li Mingjun1, Ma Yong1, Gao Jie1,2, Mao Yamei1, Zhou Bing1, Yu Shengwang1
1.Materials Science and Engineering, Taiyuan University of Technology, Taiyuan 030024 , China;2.State Key Laboratory of Vacuum Electronic Science and Technology, University of Electronic Science and Technology, Chengdu 610054 , China
Abstract:
Diamond / copper composites has become the research focus of a new generation of thermal management materials due to its low density, high thermal conductivity and adjustable coefficient of thermal expansion. The diamond / copper composites are reviewed in three directions: theory, experiment and simulation, which is expected to provide reference and ideas for research and industry development in the field of thermal management. This paper reviews the development history of diamond / copper composites, summarizes the important particle mixing theoretical models and “sandwich” composite structure empirical formulas of diamond / copper composites, studies the important factors affecting two thermal performance indicators such as thermal conductivity and thermal expansion coefficient, and briefly describes application of the finite element simulation in diamond / copper composites. Among them, the influence of interface modification (type of active modified elements and thickness of modified layers) on the thermal conductivity of diamond / copper composites is mainly analyzed. The results show that the diamond / copper composites prepared by interfacial modification, increased contact area, and driven by higher temperature and pressure mechanisms have excellent thermophysical properties. Finally, methods such as bimodal diamond, carburizing, and surface texture of large-size diamond self-supporting films are proposed based on the obtained conclusions, which can be used to improve the interface bonding strength and heat dissipation performance of diamond / copper composites.
Key words:  diamond / copper composites  theoretical model  interface modification  finite element simulation  thermal conductivity  coefficient of thermal expansion
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