| 引用本文: | 王敏， 刘锦云， 付正鸿， 毛蔚.紫铜化学镀Ni-P合金工艺[J].中国表面工程,2013,26(5):90~95 |
| WANG Min, LIU Jin yun, FU Zheng hong, MAO Wei.Technology of Electroless Ni-P Alloy on Copper[J].China Surface Engineering,2013,26(5):90~95 |
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| 摘要: |
| 以酸性含锌活化液活化紫铜基体，获得了化学镀Ni P合金镀层。采用正交试验法，研究了锌粉含量、活化温度、活化时间以及施镀时间对Ni P合金镀层性能的影响，优化得到了试验范围内的最佳工艺参数：锌粉含量为9 g/L，活化温度为60～70 ℃，活化时间为90 s，施镀时间为80 min。以此工艺参数获得的镀层与紫铜基体结合良好，沉积速率为10.13 μm/h，显微硬度可达578.3 HV0.01，无孔隙缺陷，并且镀层为非晶态结构，其含P量为11.83%。这将大大提高紫铜基体的耐磨性和耐蚀性。 |
| 关键词: 化学镀 Ni P合金 紫铜 酸性含锌活化液 |
| DOI：10.3969/j.issn.1007-9289.2013.05.016 |
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| Technology of Electroless Ni-P Alloy on Copper |
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WANG Min, LIU Jin yun, FU Zheng hong, MAO Wei
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School of Materials Science and Engineering, Xihua University, Chengdu 610039
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| Abstract: |
| The electroless Ni P alloy coating was obtained on the copper base activated by the acid activation solution with zinc. The effects of zinc content, activation temperature, activation time and plating time on Ni P alloy coating were investigated by the orthogonal test. The optimal process parameters were obtained: zinc content 9 g/L, activation temperature 6070 ℃, activation time 90 s, and plating time 80 min. Through these process parameters, the coating has a good combination with the copper base, the deposition rate is 10.13 μm/h, the microhardness reaches 578.3 HV0.01, and the Ni P alloy coating with 11.83% P and without void defect is amorphous structure. The wear resistance and corrosion resistance of copper have significantly been improved. |
| Key words: electroless Ni P alloy copper acid activation solution with zinc |
