| 摘要: |
| 针对金属基体超疏水表面制备工艺的适用性，采用电镀镀铜结合化学镀银的方法，经过正十八硫醇修饰后在一些常见金属如铜、铝、镍、不锈钢表面构建了微纳层级结构并实现了稳定的超疏水性。通过接触角测量仪（OCA—20）、场发射扫描电子显微镜（FESEM）和X射线光电子能谱（XPS）表征表面的接触角、形貌结构和镀层成分，并分析恒流镀铜与脉冲镀铜的结构成分差异。结果表明：采用脉冲镀铜化学镀银的方法经表面修饰构建了葡萄球状及花菜状的微纳米层级结构，水滴接触角约158°，滚动角均在4°以下，其中黄铜基（H62）与铝基（5052）表面滚动角可达0.1°；表面经过划痕法与挫刀法处理后未见镀层及修饰层脱落，结合力较好；pH在1~14范围内进行耐酸碱测试，所得表面具备一定耐腐蚀性。该工艺成本适中、方便快捷、基体适用范围广，具备潜在的工业应用价值。 |
| 关键词: 超疏水 金属基 脉冲电镀 化学镀 |
| DOI：10.11933/j.issn.1007-9289.2015.05.001 |
| 分类号: |
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| Fabrication of Superhydrophobic Surface on Metallic Substrate by Pulse Cu Electroplating and Silver Plating |
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ZHANG Qian, CAO Kai, CHEN Fuming1,2
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1. Shenzhen Key Laboratory of Separation Technology, Research Institute of Tsinghua University in Shenzhen;2. Department of Chemical Engineering, Tsinghua University,
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| Abstract: |
| To build superhydrophobic surface (SHS) on metallic substrate with a wide range of application, the Cu electroplating and Ag chemicalplating were adopted to construct micronano hierarchical structure on common metals like copper, aluminum, nickel and stainless steel, which showed stable superhydrophobicity after being modified by noctadecanethiol. The contact angle, microscopic morphology and components of the plating layer were analyzed by OCA—20, FESEM and XPS respectively. The structural and componential differences were also compared between the surfaces by constantcurrent and pulsecurrent Cu electroplating. The results show that the botryoid and cauliflowerlike micronano hierarchical structure is constructed by pulsecurrent Cu electroplating and Ag chemicalplating. The contact angle on different substrates reaches 158°, while the sliding angle (SA) keeps less than 4°, among of which the SHS on brass and aluminum has a SA of nearly 0°. The plating layer and modification layer show no detachment in the scratch and filing test, thus indicating a superior adhesion. The acid and alkaline resistant tests are conducted in a wide range of pH from 1 to 14, which show that these surfaces are able to generally resist corrosion. This technique is simple, timesaving and pragmatic with a moderate expenditure, thus possesses a good prospect in industrial application. |
| Key words: superhydrophobicity metallic substrate pulse electroplating chemical plating |
