摘要: |
以酸性含锌活化液活化紫铜基体,获得了化学镀Ni P合金镀层。采用正交试验法,研究了锌粉含量、活化温度、活化时间以及施镀时间对Ni P合金镀层性能的影响,优化得到了试验范围内的最佳工艺参数:锌粉含量为9 g/L,活化温度为60~70 ℃,活化时间为90 s,施镀时间为80 min。以此工艺参数获得的镀层与紫铜基体结合良好,沉积速率为10.13 μm/h,显微硬度可达578.3 HV0.01,无孔隙缺陷,并且镀层为非晶态结构,其含P量为11.83%。这将大大提高紫铜基体的耐磨性和耐蚀性。 |
关键词: 化学镀 Ni P合金 紫铜 酸性含锌活化液 |
DOI:10.3969/j.issn.1007-9289.2013.05.016 |
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Technology of Electroless Ni-P Alloy on Copper |
WANG Min, LIU Jin yun, FU Zheng hong, MAO Wei
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School of Materials Science and Engineering, Xihua University, Chengdu 610039
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Abstract: |
The electroless Ni P alloy coating was obtained on the copper base activated by the acid activation solution with zinc. The effects of zinc content, activation temperature, activation time and plating time on Ni P alloy coating were investigated by the orthogonal test. The optimal process parameters were obtained: zinc content 9 g/L, activation temperature 6070 ℃, activation time 90 s, and plating time 80 min. Through these process parameters, the coating has a good combination with the copper base, the deposition rate is 10.13 μm/h, the microhardness reaches 578.3 HV0.01, and the Ni P alloy coating with 11.83% P and without void defect is amorphous structure. The wear resistance and corrosion resistance of copper have significantly been improved. |
Key words: electroless Ni P alloy copper acid activation solution with zinc |