| 引用本文: | 潘佳宝,贾卫平,吴蒙华,苏晓冰,刘涛.定域性电化学增材制造三维微螺旋构件工艺[J].中国表面工程,2023,36(1):95~105 |
| PAN Jiabao,JIA Weiping,WU Menghua,SU Xiaobing,LIU Tao.Process for Localized Electrochemical Additive Manufacturing of Three-dimensional Micro-spiral Components[J].China Surface Engineering,2023,36(1):95~105 |
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| 摘要: |
| 针对电化学增材制造已有较多探究，但研究内容多为工艺参数对柱体成形质量的影响，工艺参数对微螺旋构件的影响尚缺乏系统研究。通过单因素试验法研究极间电压、脉冲占空比和初始极间隙对微螺旋结构直径、体沉积速率和表面形貌的影响，采用数字显微镜及扫描电镜对微螺旋构件进行检测，得出极间电压为 4.0~4.4 V 时，可以制备出直径均匀、形状规整的微螺旋结构，微螺旋结构体沉积速率由 210 μm3 / s 增长至 5 728 μm3 / s；而电压增至 4.6 V 时，微螺旋结构出现大量瘤状沉积。当初始极间隙从 5 μm 增加到 20 μm 时，微螺旋结构平均直径由 128 μm 增长至 163 μm。极间电压为 4.2 V、初始极间隙为 10~20 μm 时，随着初始极间隙的增大，微螺旋结构底部明显变粗，直径波动较大。研究结果表明，采用三轴联动控制阳极运动轨迹，定域电化学增材制造三维微螺旋构件，是三维金属微结构一种可行的技术方法。试验优化参数为极间电压 4.2 V、 脉冲占空比 60%和初始极间隙 5 μm 时，得到微观形貌质量较好、直径均匀的微螺旋构件(圈数为 2 圈、螺距为 400 μm)。 |
| 关键词: 增材制造 定域电沉积 微螺旋结构 初始极间隙 极间电压 脉冲占空比 |
| DOI：10.11933/j.issn.1007?9289.20220331001 |
| 分类号:TQ153 |
| 基金项目:国家自然科学基金资助项目(51875071) |
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| Process for Localized Electrochemical Additive Manufacturing of Three-dimensional Micro-spiral Components |
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PAN Jiabao, JIA Weiping, WU Menghua, SU Xiaobing, LIU Tao
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College of Mechanical Engineering, Dalian University, Dalian 116622 , China
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| Abstract: |
| Localized electrochemical additive manufacturing technology has long always been a research hotspot in the field of additive manufacturing, because of its advantages such as deposition on a variety of materials, electrodeposited high- precision complex structures, and production of the micro- and nanoscale metal parts. Most studies have focused on the influence of process parameters on microcylinder electrodeposition; their influence on microspiral parts has yet to be investigated systematically. In this study, micronickel spiral parts with a height of approximately 1 mm were successfully manufactured using localized electrochemical additive manufacturing technology. Single-factor experiments were carried out to investigate the effects of the electrode voltage, pulse duty cycle, and initial interelectrode gap on the diameter of spiral parts, rate of deposition and surface morphology. An electrochemical deposition experimental platform was built with a tapered platinum wire and copper plate as the anode and cathode, respectively. The electroplating solution flowed from the microgap between the anode and diversion cavity down to the surface of the copper substrate, applying the voltage. A three-axis linkage platform was used to control the trajectory of the anode. The microspiral parts were electrodeposited by the precise point-to-point matching path of the anode to the deposition structure. The microscopic morphology and cross-sectional diameters of the bottom, middle, and tip of the microspiral component were investigated by scanning electron microscopy and digital microscopy. The results show that the electrode voltage, initial electrode gap, and duty cycle are the key parameters that determine whether the spiral structure can be formed. The spiral microcomponent is divided into three parts: the bottom part deposited on the copper substrate plane, the middle rotating part, and the tip of the spiral structure. The electrodeposited bottom structure tends to be conical, which is the tip effect at the end of the shape.When the electrode voltage is between 4.0 V and 4.4 V, the microspiral parts display a uniform and regular structure, and a large number of nodular deposits up to 4.6 V. The deposition rate increased from 210 μm3 / s to 5 728 μm3 / s when the voltage increased from 4.0 V to 4.6 V, which tends to grow linearly. The average diameter of the microspiral structure increased from 128 μm to 163 μm when the initial interelectrode gap increased from 5 μm to 20 μm. The bottom of the microspiral structure became thicker and the diameter fluctuations increased. The spiral structure has regular shape and uniform diameter when the pulse duty ratio is between 50% and 60%. When the pulse duty cycle increased to 70–80%, the spiral structure appeared as large tumor-like deposits. Finally, the microspiral component (two turns; pitch of 400 μm) with good micromorphology and uniform diameter was obtained under the following optimized experimental parameters: interelectrode voltage of 4.2 V, pulse duty cycle of 60%, and initial electrode gap of 5 μm. This study demonstrates the feasibility of using localized electrochemical additive manufacturing technology to produce three-dimensional metal microspiral structures. |
| Key words: additive manufacturing localized electrodeposition micro-spiral initial gap electrode voltage pulse duty cycle |
