引用本文:宋肖肖,崔子凡,何鹏,胡隆伟,董艇舰.磁控溅射银镀层和电镀银镀层硬度及结合性对比研究∗[J].中国表面工程,2021,34(1):104~111
Song Xiaoxiao,Cui Zifan,He Peng,Hu Longwei,Dong Tingjian.Comparison of Hardness and Adhesion Strength between Magnetron Sputtered and Electroplated Silver Coatings[J].China Surface Engineering,2021,34(1):104~111
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磁控溅射银镀层和电镀银镀层硬度及结合性对比研究∗
宋肖肖1, 崔子凡1, 何鹏1, 胡隆伟2, 董艇舰3
1.中国民航大学中欧航空工程师学院 天津 300300;2.贵州航天精工股份有限公司 遵义 563006;3.中国民航大学航空工程学院 天津 300300
摘要:
采用电镀与中频-直流磁控溅射技术分别在 Inconel 718 镍基高温合金基体表面制备银镀层。 使用维氏显微硬度计和微纳米划痕仪分别测量两种镀层在室温下、工况使用温度退火后、极限温度退火后的硬度与附着力;借助 SEM、EDS 观察测试镀层的微观形貌以及元素构成在不同保温处理后的变化。 结果表明,在室温 25 ℃ 下磁控溅射银镀层的显微硬度是 139. 7 HV, 其硬度与电镀银镀层相比增强 45. 5%;附着力为 40 N,是电镀法制得的 3 倍。 保温处理后由于中频-直流磁控溅射法制得的银镀层的单个晶粒平均尺寸更小且分布更均匀,镀层与基体间界面的氧化被更好地抑制。 相比传统电镀银镀层,400 ℃ 下磁控溅射银镀层硬度与结合性相比电镀银镀层有显著提高;但在 650 ℃下优势较小,24 h 后两种镀层都出现脱落。
关键词:  磁控溅射  银镀层  显微硬度  附着力  失效机理
DOI：10.11933/j.issn.1007-9289.20201224001
分类号:TG174
基金项目:中国民航大学专项资助项目(3122019177)
Comparison of Hardness and Adhesion Strength between Magnetron Sputtered and Electroplated Silver Coatings
Song Xiaoxiao1, Cui Zifan1, He Peng1, Hu Longwei2, Dong Tingjian3
1.Sino-European Institute of Aviation Engineering, Civil Aviation University of China, Tianjin 300300 , China;2.Guizhou Aerospace Precision Co., Ltd., Zunyi 563006 , China;3.Aeronautical Engineering Institute, Civil Aviation University of China, Tianjin 300300 , China
Abstract:
Silver coatings were prepared by medium frequency-direct current(MF-DC) magnetron sputtering and traditional electropla- ting on Inconel 718. The hardness and adhesion strength of the two coatings under different temperature conditions were measured by Vickers microhardness tester and micro-nano scratcher. The microstructures and elemental composition of the coatings were analyzed u- sing SEM and EDS. Results show that the microhardness of the magnetron sputtered silver coating at 25 ℃ is 139. 7 HV, increasing by 45. 5% compared with the electroplated silver coating, and the adhesion strength is 40 N which is 2 times higher than electroplated sil- ver coating. Due to the smaller average size of single crystal grains and more uniform distribution in the silver coating deposited by MF- DC magnetron sputtering, the oxidation of the interface between the coating and the substrate is suppressed. Comparing to the electro- plated silver coating, its hardness and adhesion strength at 400 ℃ are significantly improved. But after 24 hours at 650 ℃ , both coat- ings peel off.
Key words:  magnetron sputtering  silver coating  microhardness  adhesion strength  failure mechanism
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