引用本文:黄鹤,邱长军,陈勇,胡良斌,刘艳红,李怀林.锆合金表面磁控溅射与多弧离子镀Cr涂层的高温抗氧化性能[J].中国表面工程,2018,31(2):51~58
HUANG He,QIU Chang-jun,CHEN Yong,HU Liang-bin,LIU Yan-hong,LI Huai-lin.High Temperature Oxidation Resistance of Magnetron Sputtering and Multi-arc Ion Plating Cr Films on Zirconium Alloy[J].China Surface Engineering,2018,31(2):51~58
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锆合金表面磁控溅射与多弧离子镀Cr涂层的高温抗氧化性能
黄鹤1, 邱长军1, 陈勇1, 胡良斌1, 刘艳红2, 李怀林2
1.南华大学 机械工程学院, 湖南 衡阳 421001;2.国家电投集团中央研究院, 北京 102209
摘要:
为了研究磁控溅射（MS）和多弧离子镀（MAIP）技术制备Cr涂层的高温抗氧化性能，分别在锆合金表面制备厚度约5 μm的Cr涂层。利用氧化动力学曲线对比研究800℃条件下涂层的高温抗氧化性能，利用SEM、XRD、EDS分析涂层表面形貌和相结构。结果表明：磁控溅射和多弧离子镀Cr涂层均能显著提高锆合金的高温抗氧化性能；磁控溅射Cr涂层表面光滑、致密，但涂层表面存在一定数量的孔洞，占涂层表面积0.40%，氧化7 h后涂层表面出现裂纹，单位面积氧化增重6.434 mg/cm2；与磁控溅射Cr涂层相比，多弧离子镀Cr涂层不再有（211）单一择优取向，Cr涂层厚度均匀，表面平整，膜/基界面分明，孔洞相对较少，占涂层表面积0.21%，氧化7 h后涂层表面依然致密，单位面积氧化增重5.616 mg/cm2，高温抗氧化性能优于磁控溅射Cr涂层。
关键词:  磁控溅射  多弧离子镀  Cr涂层  孔洞  高温抗氧化性能
DOI：10.11933/j.issn.1007-9289.20170903002
分类号:TG174.444
基金项目:国家科技重大专项（2015ZX06004001-002）；湖南省重点学科建设（湘教发[2011]76）；湖南省高校重点实验室基金（湘教发[2014]85）
High Temperature Oxidation Resistance of Magnetron Sputtering and Multi-arc Ion Plating Cr Films on Zirconium Alloy
HUANG He1, QIU Chang-jun1, CHEN Yong1, HU Liang-bin1, LIU Yan-hong2, LI Huai-lin2
1.School of Mechanical Engineering, University of South China, Hengyang 421001, Hunan;2.State Power Investment Corporation Central Research Institute, Beijing 102209
Abstract:
In order to study the high temperature oxidation resistance of Cr films deposited using magnetron sputtering (MS) and multi-arc ion plating (MAIP) methods, Cr films with a thickness of approximately 5 μm were deposited on the surface of zirconium alloy through different methods. The oxidation kinetics curve was used to compare the high temperature oxidation resistance of the coating at 800℃. Microstructure and phase structure of the films were investigated by SEM, XRD and EDS, respectively. The results show that the high temperature oxidation resistance of zirconium alloys is significantly enhanced by the Cr fims depoisted by MS and MAIP. The Cr films surface deposited by MS is continuous and uniform without obvious cracks, however, many holes(0.40%) are observed after high temperature oxidation of 7 h. The oxidation resistance is increased by 6.434 mg/cm2. Compared with the Cr films deposited by MS, the single optimal orientation (211) of the Cr films deposited by MAIP is vanished. Cr films have uniform thickness, smooth surface and clear layer/matrix interface. Moreover, only 0.21% holes exist on the films' surface which shows the stronger high temperature oxidation resistance. The oxidation increase of Cr films is 5.616 mg/cm2, remaining compact after high temperature oxidation of 7 h.
Key words:  magnetron sputtering(MS)  multi-arc ion plating(MAIP)  Cr films  holes  high temperature oxidation resistance
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