| 摘要: |
| 文中报道了一种借助多巴胺在PEEK表面化学镀铜的方法。首先通过非溶剂致相分离法对PEEK表面进行粗化，形成网络状孔洞，然后借助多巴胺的自身氧化聚合在PEEK表面包覆聚多巴胺层，利用聚多巴胺对银离子的吸附和原位还原作用在PEEK表面沉积纳米银颗粒，纳米银颗粒作为催化中心催化化学镀铜反应的进行，从而在PEEK表面镀覆金属铜层。通过SEM、EDS、接触角测试、XRD表征复合材料的形貌、化学组成、润湿性和结晶形态，通过胶带剥离实验评估镀层结合力，使用四探针测试仪测量镀层的方块电阻。结果表明，纳米银可以有效地催化PEEK表面的化学镀铜反应，且镀液稳定，铜层与PEEK的结合力达到5B级；施镀时间为60 min时，由断面图测得的镀层厚度约为3.5 μm，方块电阻低至19 mΩ/□。 |
| 关键词: 聚醚醚酮 多巴胺 化学镀铜 无钯化学镀 |
| DOI：10.11933/j.issn.1007-9289.2016.05.004 |
| 分类号: |
| 基金项目:广州市产学研协同创新重大专项民生科技研究项目（1561000293） |
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| Electroless Copper Plating on PEEK Surface Modified by Dopamine |
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HU Jia-xun, WU Shu-qing
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School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640
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| Abstract: |
| A facile and efficient approach was developed to prepare copper-plated PEEK sheet with the assist of dopamine. The PEEK surface was coarsened by the method of non-solvent induced phase separation (NIPS) to obtain a large number of microscopic interconnected holes. Then the coarse surface was coated by polydopamine via the oxidative self-polymerization of dopamine. Silver ions were adsorbed and in situ reduced into silver nanoparticles by polydopamine. Silver nanoparticles served as catalytic seeds to catalyze the electroless copper plating. The surface morphology, chemical composition, wettability and crystalline structure of samples were investigated by scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDS), contact angle measurement and X-ray diffraction (XRD). The adhesion strength of the copper layer was evaluated by scotch-tape test. The sheet resistance of copper-plated PEEK was tested by the four-point probe measurement. Results show that silver nanoparticles can effectively catalyze the polydopamine-assisted electroless copper plating on the PEEK surface with a more stable process. The copper layers are deposited on the PEEK surface with a good adhesion strength (5B scale). When the plating time is 60 min, the thickness of the copper layer reaches 3.5 μm (measured in the cross-section SEM image) and the sheet resistance is as low as 19 mΩ/□. |
| Key words: poly(ether-ether-ketone) dopamine electroless copper plating palladium-free electroless plating |
