| 摘要: |
| 分析了金刚石线切割硅晶片的表面形貌和断裂性能，并在此基础上探讨金刚石线切割原理以及一些技术挑战。金刚石线切割具有表面粗糙度低，硅片厚度均匀等优点，但却存在断裂强度各项异性。与切割划痕垂直方向的力学性能很高，然而与划痕平行方向的力学性能较低，这种性能差异是由表面单方向裂纹引起的，其裂纹的产生又与切割机理密切有关。金刚石线切割属于二体磨料磨损，其切割方式通常为塑性划痕，加之有少量脆性剥落。由于切割线的柔性，以及金刚石磨粒大小、形态、及分布的差异，切割过程则会出现切割的不连续性和不稳定性，并由此引起一些较大的表面裂纹。此外，划痕沟槽局部还会出现非晶态结构。提高金刚石线切割性能应从切割线磨粒角度来考虑。 |
| 关键词: 金刚石线切割 表面形貌 断裂强度 切割机理 |
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| Surface Characteristics and Its Mechanical Performance of Diamond Wire |
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YANG Ye-yuan
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Manufacturing Institute, Georgia Institute of Technology, Atlanta GA 30332, USA
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| Abstract: |
| The surface morphology and fracture properties of diamond wire sawn silicon wafers were analyzed. The cutting mechanism and some key challenges with diamond wire sawing are also discussed. Diamond wire sawing has the advantages of low surface roughness and better thickness uniformity, but endures a disadvantage of fracture strength anisotropy. Higher mechanical property exists in the direction perpendicular to the saw marks, but lower in the parallel direction. This performance difference results from the unidirectional surface microcracks, which is further tied closely with the cutting mechanism. Diamond wire sawing belongs to the twobody wear process, where the scratching is dominated, but with a small amount of brittle fracturing at meantime. Due to the flexibility of the cutting wire and the variation of the diamond grain size, shape, and distribution, there may exist cutting discontinuity and instability in the sawing process, which then produces relatively large surface microcracks. Meanwhile, amorphous silicon may formed in the scratch grooves. To improve the cutting performance, the improvement of diamond grits should be pursued. |
| Key words: diamond wire sawing surface morphology fracture strength cutting mechanism |
