| 引用本文: | 林琳， 宋巍， 李长青.低粘度环氧树脂体系的固化动力学及其热稳定性[J].中国表面工程,2011,24(5):73~77 |
| LIN Lin, SONG Wei, LI Chang–qing.Curing Kinetics and Thermal Stability of Low Viscosity Epoxy Resin Systems[J].China Surface Engineering,2011,24(5):73~77 |
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| 摘要: |
| 采用一种新型奇士增韧剂对环氧树脂进行增韧改性，获得一种热熔预浸料用环氧树脂体系，采用NDJ8S型旋转粘度仪对环氧树脂体系的粘度进行测定，应用差示扫描量热法(DSC)对环氧树脂体系的固化反应过程进行分析，并确定其固化反应动力学参数，利用热失重分析法(TGA)对其热稳定性进行研究。结果表明：环氧树脂体系的粘度较低，50 ℃时仅为3.5 Pa·s。采用外推法得出环氧树脂体系的凝胶温度为58.82 ℃，固化温度为139.08 ℃，后固化温度为265.92 ℃，通过计算得出表观活化能E为53.1 kJ/mol，反应能级为0.88。室温下固化反应速率较低，约为3.28×10-3 s-1，有利于存储，同时树脂体系起始分解温度达271.23 ℃，具有良好的热稳定性。 |
| 关键词: 低粘度 固化动力学 热稳定性 |
| DOI： |
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| 基金项目:武器装备预研基金（代号略） |
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| Curing Kinetics and Thermal Stability of Low Viscosity Epoxy Resin Systems |
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LIN Lin, SONG Wei, LI Chang–qing
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Department of Equipment Remanufacture Engineering, Academy of Armored Force Engineering, Beijing 100072
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| Abstract: |
| A new toughener was applied to toughening the epoxy resin, and got a hotmelt prepreg epoxy resin. The NDJ8S rotation viscometer was adopted in the viscosity testing. The curing kinetics and thermal stability of different elements mingle epoxy resin was studied by DSC and TGA,and the determination of cure kinetic parameters was confirmed.The results showed that the viscosity of epoxy resin systems was very low, just 3.5 Pa·s at 50 ℃. The gelling temperature,curing temperature and post curing temperature were 58.82 ℃，139.08 ℃，265.92 ℃， which obtained by extrapolating Tβ curves. The values of apparent activation energy was 53.1 kJ/mol and the reaction order was 0.88. The epoxy resin curing reaction rate at room temperature was 3.28×10-3 s-1, which was favorable to storage. The initial decomposition temperature of the adhesive system was 271.23 ℃, whic showed high thermal stability. |
| Key words: low viscosity curing kinetics thermal stability |
