| 引用本文: | 沈艺程，续振林，赵雄超，辜志俊.激光表面处理对陶瓷基底化学镀铜层结合力的影响[J].中国表面工程,2006,(4):28~31 |
| SHEN Yi-cheng, XU Zhen-lin, ZHAO Xiong-chao, GU Zhi-jun.The effect of Laser Treatment on the Bonding Strength Between Ceramic Substrate and Cu Electroless Plating layer[J].China Surface Engineering,2006,(4):28~31 |
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| 摘要: |
| 通过改变激光扫描间距对陶瓷基底进行表面处理得到不同粗糙度的陶瓷表面，经化学镀后在该基底上沉积一层金属铜层，探讨了不同粗糙度表面对所得到的金属镀铜层与陶瓷基底表面结合力的影响。激光扫描间距对陶瓷表面经激光处理后所得的表面粗糙度有很大影响，当激光扫描间距选择介于1～4 μm之间时能得到粗糙度值相对较高的陶瓷表面。镀层与基底的结合力随着陶瓷表面粗糙度的增加而增大，试验可得到与陶瓷基底结合力高达16.5 N/mm2的化学镀铜层，这远远达到普通工业化应用要求。 |
| 关键词: 激光处理 化学镀铜 粗糙度 结合力 |
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| The effect of Laser Treatment on the Bonding Strength Between Ceramic Substrate and Cu Electroless Plating layer |
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SHEN Yi-cheng, XU Zhen-lin, ZHAO Xiong-chao, GU Zhi-jun
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Fujian Institute of Rearsch on the Structure of Matter, Fuzhou China, 350002
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| Abstract: |
| The Ceramic surfaces with different roughness were obtained after laser treatment with different scan space, then a Cu coating was deposited on the substrate by electroless plating technology. In this paper, the effect of roughness of ceramic surface on the bonding strength between ceramic substrate and Cu electroless plating layer was discussed. The scan space of laser showed a great effect on the roughness of ceramic surface. When the scan space of laser was 1～4 μm, it was possible to get the ceramic surface with higher roughness It was also noticed that the bonding strength between ceramic substrate and Cu layer was increasing when the roughness of ceramic surface was enhanced accordingly. In this research, a Cu electroless plating layer with bonding strength 16.5 N/mm2 was obtained, it exceeded the demand of common industrial application greatly. |
| Key words: laser process electroless plating Cu roughness binding strength |
