引用本文:娄红涛,冯 辉,李基森,杨卫花,陈 玫.MLCC三层镀中甲基磺酸镀锡体系工艺条件对锡镀层性能影响的研究[J].中国表面工程,2005,(6):35~40
.Study on Effect of Processing Conditions on Tin Coating Performance in MLCC Three-Layer Plating[J].China Surface Engineering,2005,(6):35~40
【打印本页】   【HTML】   【下载PDF全文】   【查看/发表评论】  【EndNote】   【RefMan】   【BibTex】
←前一篇|后一篇→ 过刊浏览    高级检索
本文已被：浏览 4273次   下载 4796次 本文二维码信息
码上扫一扫！
分享到： 微信 更多
字体:加大+|默认|缩小-
MLCC三层镀中甲基磺酸镀锡体系工艺条件对锡镀层性能影响的研究
娄红涛，冯 辉，李基森，杨卫花，陈 玫
作者单位
摘要:
研究了片式多层陶瓷电容器(MLCC)三层镀中甲基磺酸镀纯锡体系pH值、温度、电流密度等工艺条件及杂质金属离子对镀液稳定性、镀层结构和性能等方面的影响。从电流效率、沉积速度及锡镀层表面的扫描电镜等方面,对比了不同pH值、温度、电流密度以及锡镀液中掺杂Cu2+、Ni2+后对锡镀层结构和性能的影响。研究结果给出了电镀工艺中最佳的pH值为3.5±0.2、温度为(23±2)℃、电流密度可以有较宽的范围,当镀液中掺有镍、铜等杂离子会对镀层产生负面影响,在给出的工艺参数下电镀,可以确保镀出最佳的纯锡镀层。
关键词:  甲基磺酸  镀锡体系  工艺条件  镀层性能
DOI：
分类号:
基金项目:
Study on Effect of Processing Conditions on Tin Coating Performance in MLCC Three-Layer Plating
LOU Hong-tao, FENG Hui, LI Ji-sen, YANG Wei-hua, CHEN Mei
Abstract:
In this paper, the effect of processing conditions, such as pH value, temperature, current density and impure metal ions, on electroplating solution stability and tin coating structure and performance in MLCC(Multilayer Ceramic Capacitor) three-layer plating was studied.,. By means of current efficiency, deposition rate and SEM analyses , the effect of different pH value, temperature, current density and Cu2+ and Ni2+ on tin coating structure and performance were also examined. The optimum pH value 3.5±0.2, temperature (23±2) ℃ and wider current density range in plating technology were obtained, the harmful influence of Cu2+ and Ni2+ on coating performance was determined . The optimal pure tin coating can be prepared using the given processing parameters.
Key words:  methanesulfonic acid  tin-plating system  process conditions  coating capability
手机扫一扫看