引用本文:张 尹,李基森,齐 坤,陈 玫,娄红涛.片式电子元器件中无铅可焊镀层的研究[J].中国表面工程,2005,(2):1~4,11
.Study on Lead-free Weldable Coating of Chip Electronic Components[J].China Surface Engineering,2005,(2):1~4,11
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片式电子元器件中无铅可焊镀层的研究
张 尹，李基森，齐 坤，陈 玫，娄红涛
作者单位
摘要:
研究了对片式电子元器件以纯Sn镀层取代可焊性优异但环保性差的Sn-Pb镀层在生产过程中遇到的问题及解决途径。结果表明，Sn镀层上的“晶须”是制约其使用的主要问题，通过镀覆中间层、控制Sn层厚度、选择减小镀层压应力的添加剂、采用甲基磺酸锡体系镀哑光Sn等措施能有效抑制“晶须”的产生，获得可焊性好、能满足片式电子元器件批量生产质量要求的无铅镀层。介绍了以预镀Au、Pd取代Sn-Pb镀层的进展。
关键词:  无铅  锡镀层  片式元器件
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基金项目:国家"十五""863"计划资助项目(2001AA32G030)
Study on Lead-free Weldable Coating of Chip Electronic Components
ZHANG Yin, LI Ji-sen, QI Kun, CHEN Mei, LOU Hong-tao
Abstract:
The problems occurred in the replacement of Sn–Pb coating, which has excellent weldable but bad environmental protection performance, by the pure tin coating and their solutions were studied. The results showed that the whiskers formed on the tin coating was the main factor restricting its application. Adopting some methods, including electroplating middle coating, controlling tin coating thickness, selecting additive, which can reducing coating compressive stress, using tin methyl sulfonate system to electroplating dull tin coating and so on, the tin whiskers can be restrained effectively, and a better weldable lead-free coating, which can fulfill the needs of chip electronic components was obtained. Besides, the progress of previously plating Au and Pd replacing Sn–Pb coating was introduced as well.
Key words:  lead-free  tin coating  chip component
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