引用本文:龚才, 代明江, 陈明安, 韦春贝, 侯惠君.基体材料对TiN薄膜表面液滴及薄膜结合力的影响[J].中国表面工程,2013,26(1):27~33
GONG Cai, DAI Ming-jiang, CHEN Ming-an, WEI Chun-bei, HOU Hui-jun.Effects of Different Substrates on the Droplets and Adhesion Strength of TiN Films[J].China Surface Engineering,2013,26(1):27~33
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基体材料对TiN薄膜表面液滴及薄膜结合力的影响
龚才, 代明江, 陈明安, 韦春贝, 侯惠君1,2
1. 中南大学 材料科学与工程学院, 长沙 410083;2. 广东省工业技术研究院(广州有色金属研究院) 新材料研究所, 广州 510651
摘要:
采用真空阴极电弧离子镀技术分别在4Cr5MoSiV1(H13)模具钢、Cr18Ni9Ti(304)不锈钢、YG6硬质合金、Ti6Al4V(TC4)钛合金4种基体表面沉积TiN薄膜。利用扫描电镜(SEM)对薄膜表面液滴进行观察分析,通过划痕仪对薄膜的膜/基结合力进行表征。结果表明:基体材料不同,TiN薄膜上液滴的密度、尺寸存在明显的区别。其中,镀膜后H13钢和304不锈钢表面的液滴数量最多,YG6硬质合金次之,TC4钛合金最少;薄膜的膜/基结合强度依次为YG6硬质合金>H13钢>304不锈钢>TC4钛合金。
关键词:  真空阴极电弧离子镀  TiN薄膜  液滴  膜/基结合力
DOI:
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基金项目:
Effects of Different Substrates on the Droplets and Adhesion Strength of TiN Films
GONG Cai, DAI Ming-jiang, CHEN Ming-an, WEI Chun-bei, HOU Hui-jun1,2
1. School of Materials Science and Engineering, Central South University, Changsha 410083;2. Institute of Surface Engineering, Guangzhou Research Institute of Nonferrous Metals, Guangzhou 510651
Abstract:
TiN films were deposited on 4Cr5MoSiV1(H13) die steel,Cr18Ni9Ti(304) stainless steel,YG6 cemented carbide and Ti6Al4V (TC4) titanium alloy substrates, respectively, by vacuum cathodic arc ion plating. Droplets on TiN films were observed and analysed by scanning electron microscopy (SEM) and the adhesion strength of the coating was characterized by scratching tester. The results show that droplets densities and sizes on the film surfaces have evident difference among the four different substrates. From the statistical analysis of the experimental results, the number of droplets on H13 steel and 304 stainless steel are much more than that on YG6 cemented carbide and TC4 titanium, and the droplets densities on TC4 titanium is the least. Adhesion strength of the films on the four substrates are also different. From the highest to the lowest, the adhesion strength of films on different substrates are, in order, YG6 cemented carbide, H13 steel, 304 stainless steel and TC4 titanium.
Key words:  vacuum cathodic arc ion plating  TiN films  droplets  film/substrate adhesion strength
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