| 引用本文: | 肖发新a, b，曹 岛a，孟志广a，毛建伟a，杨涤心a，申晓妮a.添加剂对PCB酸性铜镀层质量及镀液性能影响[J].中国表面工程,2011,24(2):74~79 |
| XIAO Fa?xina, b, CAO Daoa, MENG Zhi?guanga, MAO Jian?weia, YANG Di?xina, SHEN Xiao?nia.Influences of Additives on Coating Quality and Bath Performance in Acid Copper Plating of PCB[J].China Surface Engineering,2011,24(2):74~79 |
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| 摘要: |
| 采用霍尔槽法、电化学、SEM、XRD等方法研究了添加剂浓度对酸性铜镀层质量及镀液性能的影响。试验表明，随着添加剂BSP、PPNI、ABSS、PN加入量增大，镀层光亮区和镀液分散能力先增大后减小，其适宜的浓度分别为24 mg/L、20 mg/L、0.02 mL/L、20 mg/L。在适宜的工艺条件下施镀15 min所得镀层光亮平整，光亮区为0.6～9.8 cm，对应电流密度0～13.38 A/dm2。镀液分散能力可达到95.1 %，深镀能力L/φ至少可到5。在1～4 A/dm2下电流效率几乎为100 %。混合添加剂使铜阴极峰电位负移80 mV，峰电流由43 A/cm2降至37 A/cm2。SEM试验表明镀层光滑平整、结晶细小均匀，XRD表明镀层为面心立方Cu，且在 (111)晶面择优取向。该工艺具有电流密度及温度范围宽的特点，适合于PCB酸性镀铜生产。 |
| 关键词: 添加剂 PCB 酸性镀铜 镀层质量 镀液性能 |
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| 基金项目:国家青年自然科学基金（50904023）；河南省教育厅自然科学研究基金 (2010B450001) |
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| Influences of Additives on Coating Quality and Bath Performance in Acid Copper Plating of PCB |
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XIAO Fa?xina, b, CAO Daoa, MENG Zhi?guanga, MAO Jian?weia, YANG Di?xina, SHEN Xiao?nia
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a. School of Materials Science and Engineering b. Henan Key Laboratory of Advanced Nonferrous Metal Materials, Henan University of Science and Technology, Luoyang Henan 471003
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| Abstract: |
| The influences of additives concentrations on Cu coating quality, performance of bath were investigated using hull cell method, electrochemical technique, SEM and XRD, et al. It was found that the bright areas and throwing power of bath increase firstly and decrease afterwards with the increase of additive concentration of BSP, PPNI, ABSS and PN, and its concentrations is 24 mg/L, 20 mg/L, 0.02 mL/L and 20 mg/L, respectively. A bright and glossy coating is obtained after plating for 15 min under appropriate conditions. The bright area of coating is 0.6~9.8 cm, which accords to the current density region of 0~13.38 A/dm2. The throwing power of bath reaches 95.1 % and the ability of deep plating L/φ reaches 5. The current efficiency is almost 100 % under the current density region of 1~4 A/dm2. The cathodic peak current of copper electrodepositing decreases from 43 to 37 mA/cm2 and the peak potential shifts negatively by 80 mV under the function of mixed additives. The crystal of coating is superfine and mainly assigned to the (111) crystal face. The process can be used for PCB copper plating production due to the wide range of current density and temperature. |
| Key words: additives PCB acid copper plating coating quality bath performance |
